A postdoctoral research position is available immediately in the Johnson research group at the University of Illinois at Urbana-Champaign.  The position will involve continuum finite element modeling of multiphysics and interfacial phenomena in micro- and nanoscale electronic materials processing applications.

Abstracts are now being accepted for the 2008 Society of Engineering Science Annual Technical Meeting, to be held October 12th-15th, 2008 at the University of Illinois at Urbana-Champaign.  The conference will feature more than 30 technical symposia in Applied Mathematics, Bioengineering, Dynamics, Fluid Mechanics, Imaging, Multiscale and Nanomechanics of Solids, Mechanics of Materials, etc., as well as special symposia in honor of the 2008 SES Medalists, listed at the conference website: http://ses2008.mechse.uiuc.edu .

We are pleased to announce that the 2008 Society of Engineering Science (SES) Annual Technical Meeting will be held at the University of Illinois at Urbana-Champaign on October 12-15, 2008.  The meeting will feature themes in Solid and Fluid Mechanics; Biomechanics; Physics, Chemistry & Biology in Engineering; and Applied Mathematics.  The members of the local organizing committee, including faculty from the new Department of Mechanical Science & Engineering, the Department of Aerospace Engineering, the Department of Civil & Environmental Engineering, and the Department of Materials Science & Engineering, cordially invite you to make plans to attend this exciting conference.  More information is available at the conference website: http://ses2008.mechse.uiuc.edu/.  Individuals interested in organizing symposia at the conference should contact the organizers at ses2008mechse@uiuc.edu.

Since the early 1990s, when quantum dots and quantum wires began to attract the attention of physicists, and when carbon nanotubes were discovered, mechanics related issues have begun to emerge as important in understanding properties of nanostructures.  These structures were first considered useful mostly for their electronic or optical applications, yet deformation has been seen to play an important role in their functional characteristics.  Advances in modeling also have begun to link electronic structure with mechanical properties of materials at larger length scales, particularly when microstructural or crystallographic effects influence bulk behavior.