Ting Zhu, Ju Li, Amit Samanta, Austin Leach and Ken Gall, “Temperature and strain-rate dependence of surface dislocation nucleation”, Physical Review Letters, 100, 025502 (2008).

T. Zhu, Z. Suo, A. Winkleman, G. M. Whitesides, Applied Physics Letters, 88, 144101, (2006)

A process has been demonstrated recently to assemble microspheres on a patterned electrode under the influence of an applied voltage. Here we examine the mechanics of this process, and describe both the conditions under which excess microspheres jump off the electrode when the voltage is applied, and the forces that attract the remaining microspheres to the desired positions. A quantitative mechanistic understanding of this process rationalizes experimental observations, provides scaling relations, and suggests modifications of the process.

by S. Yip (Editor), 2005

Book Review
"A new guide to materials modeling largely succeeds in its aim to be the defining reference for the field of computational materials science and represents a huge undertaking..." -- by James Elliott | University of Cambridge, Materials Today, Volume 9, Issues 7-8, July-Aug 2006, Pages 51-52.

Book Description
The first reference of its kind in the rapidly emerging field of computational approachs to materials research, this is a compendium of perspective-providing and topical articles written to inform students and non-specialists of the current status and capabilities of modelling and simulation. From the standpoint of methodology, the development follows a multiscale approach with emphasis on electronic-structure, atomistic, and mesoscale methods, as well as mathematical analysis and rate processes. Basic models are treated across traditional disciplines, not only in the discussion of methods but also in chapters on crystal defects, microstructure, fluids, polymers and soft matter. Written by authors who are actively participating in the current development, this collection of 150 articles has the breadth and depth to be a major contributor toward defining the field of computational materials. In addition, there are 40 commentaries by highly respected researchers, presenting various views that should interest the future generations of the community. Subject Editors: Martin Bazant, MIT; Bruce Boghosian, Tufts University; Richard Catlow, Royal Institution; Long-Qing Chen, Pennsylvania State University; William Curtin, Brown University; Tomas Diaz de la Rubia, Lawrence Livermore National Laboratory; Nicolas Hadjiconstantinou, MIT; Mark F. Horstemeyer, Mississippi State University; Efthimios Kaxiras, Harvard University; L. Mahadevan, Harvard University; Dimitrios Maroudas, University of Massachusetts; Nicola Marzari, MIT; Horia Metiu, University of California Santa Barbara; Gregory C. Rutledge, MIT; David J. Srolovitz, Princeton University; Bernhardt L. Trout, MIT; Dieter Wolf, Argonne National Laboratory.

Ting Zhu, Ju Li, Amit Samanta, Hyoung Gyu Kim and Subra Suresh

Nano-twinned copper exhibits an unusual combination of ultrahigh strength and high ductility, along with increased strain-rate sensitivity. We develop a mechanistic framework for predicting the rate sensitivity and elucidating the origin of ductility in terms of the interactions of dislocations with interfaces. Using atomistic reaction pathway calculations, we show that twin boundary (TB) mediated slip transfer reactions are the rate-controlling mechanisms of plastic flow. We attribute the relatively high ductility of nano-twinned copper to the hardenability of TBs as they gradually lose coherency during deformation. These results offer new avenues for tailoring material interfaces for optimized properties.

see the attached pdf file