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Recovery of electrical resistance in copper films on PET subjected to a tensile strain

For flexible electronics applications it is important to understand the behavior of electrical resistance of metal films on polymer substrates under applied tensile strain. Although the growth of resistance during tensile loading was investigated in a number of research papers, the recovery of resistance during unloading remains virtually unexplored. In this paper, substantial recovery (decrease) of electrical resistance during and after unloading is demonstrated for copper films on polyethylene terephthalate (PET) substrates subjected to a tensile strain with different peak values.

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Symposium on Interface failure in thin film structures and composite materials at EUROMAT 2013 Sevilla, Spain, 8-13 September

Symposium on Interface failure in thin film structures and composite materials at EUROMAT 2013 Sevilla, Spain, 8-13 September 2013

At the EUROMAT 2013 (European Congress and Exhibition on Advanced Materials and Processes), taking place in Sevilla, Spain, September 8th -13th 2013, there will be an organized symposium titled "Interface failure in thin film structures and composite materials." The aim of this planned symposium is to discuss recent developments in the area of interface failure and the governing mechanisms.

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