High-performance stretchable electronics have to utilize high-quality inorganic electronic materials such as silicon, oxide or nitride dielectrics, and metals. These inorganic materials usually crack or yield at very small intrinsic strains, for example, 1%, whereas bio-integrated electronics are expected to at least match the stretchability of bio-tissues (20%) and deployable structure health monitoring networks are expected to expand from wafer scale (several centimeters) to cover macroscopic structures (several meters).
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