Dear colleagues and friends,
Please consider to contribute a talk at the symposium of “Mechanics of Instability and Interfacial Adhesion in Bio-Compatible Electronics”, organized for the 52nd Annual Technical Meeting of the Society of Engineering Science (SES). The SES 2015 meeting will be held at Texas A&M University, Oct 26-28, 2015. Abstracts are due Jun 26, 2015.
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