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mazloum's blog

A new Method for Detection of Degradation in Die-Attach Materials by In-Situ-Health Monitoring of Thermal Properties

The application of electronic products is established in many fields of everyday life, for example in automotive industry, medical or communication technology. This leads to the necessity of investigation of safety and reliability of such components. During lifetime testing of the electronic component different loads and mechanisms can lead to degradation and failure. For die attach materials these failures can be cohesive or adhesive in their nature.

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