note

Huai Huang — Sun, 11 May 2008 08:21:26 -0400

changed some incorrect notes in ppt, maybe need more polish

EM 388F Term Paper: Indentation Fracture Toughness Measurement And Application to Low K Thin Film

Huai Huang — Tue, 08 Apr 2008 00:43:50 -0400

Abstract:

As the thickness of coating thin
film is reduced it becomes increasingly difficult to measure their adhesion,
hardness, toughness by conventional methods. Indentation test methods are well
established for the determination of elastic modulus and hardness, but methods
for assessment of fracture properties are much less developed. In this term
paper, existing metrology of using indention to study fracture toughness will
be summarized and mechanics of fracture under indentation will be studied.
Experimental plans of investigation fracture toughness of OSG low-K film will
also be evaluated in the end.

1, M. F. Doerner and W. D. Nix, A Method for Interpreting
the Data form Depth-Sensing Indentation Instruments, J. Mater. Res. 1, 601-609 (1986)

2. B. Lawn, R.
Wilshaw, Indentation fracture: principles and applications, J. Mater. Sci. 10 (1975)

3. B. lawn, Fracture
of Brittle Solids (second edition), Cambridge University Press, pp.249-306,
(1993)

4. G.M. Pharr, D.S.
Harding, W.C. Oliver, Mechanical Properties and Deformation Behavior of
Materials Having Ultra-Fine Microstructures, M. Nastasi et al. (eds.), Kluwer
Academic Press, pp. 449-461, (1993)

5. I. S. Adhihetty, J. B. Vella, Alex A. Volinsky, el.,
Mechanical Properties, adhesion, and fracture toughness of low-k dielectric
thin films for microelectronic applicatons, Mechanics and Materials Summer
Conference, San Diego, June, 2001

6. J. B. Vella, I. S. Adhihetty,
K Junker, A. A. Volinsky, Mechanical properties and fracture toughness of
organo-silicate glass (OSG) low-k dielectric thin films for microelectronic
applications, International Journal of Fracture, 119/120, pp.487–499, (2003)

7. A. A. Volinskya , W. W. Gerberichb, Nanoindentaion
techniques for assessing mechanical reliability at the nanoscale, Microelectronic
Engineering 69 (2003) 519–527

iMechanica - EM 388F Term Paper: Indentation Fracture Toughness Measurement And Application to Low K Thin Film - Comments

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EM 388F Term Paper: Indentation Fracture Toughness Measurement And Application to Low K Thin Film