http://imechanica.org/node/407 Comments for "void due to electromitation" en http://imechanica.org/node/407 <p>A void forms underneath a via in the upstream of the lower-level copper line. See the <a href="http://imechanica.org/node/403">related post</a>.</p> <br class="clear" /> http://imechanica.org/node/407#comments electromigration void Sun, 12 Nov 2006 11:42:24 -0500 Zhigang Suo 407 at http://imechanica.org