iMechanica - Symposium on Mechanics of Integrated Structures and Materials in Advanced Technology - Comments

This looks like a great symposium on integrated structures

Zhigang Suo — Mon, 14 May 2007 15:39:46 -0400

Rui: This is very well organized and I'm looking forward to the symposium. Thank you and your co-organizers for getting people together.

Integrated Structures Symposium at McMat 2007

Rui Huang — Thu, 10 May 2007 17:59:45 -0400

The technical program of this symposium is now finalized as follows.

Session 16-2-1: Cu/low k interconnects I (Monday, June 04, 09:45-11:45 AM)

Session Chairs: Jun He and Rui Huang

Carl Thompson (MIT), Void Dynamics During Electromigration in Cu Interconnects (keynote)
Martin Gall (Freescale), Electromigration Early Failure Detection in Dual-Inlaid Cu Interconnects
Lijuan Zhang (UT Austin), Electromigration Reliability of 60 nm Dual Damascene Cu Interconnects
Jun He (Intel), Interconnect scaling, electromigartion lifetime, and critical void volume

Session 16-2-2: Cu/low k interconnects II (Monday, June 04, 1:15-3:15 PM)

Session Chairs: Jun He and Rui Huang

David Read (NIST), AC Fatigue Tests of Damascene Interconnect Structures (keynote)
Jin An (UT Austin), The Influence of grain orientation on local stresses in 180 nm Cu Interconnects
Youbo Lin (Harvard), Structure, mechanical properties and fracture of organosilicate glass thin films
Zhigang Suo (Harvard), Effect of coating on the reliability of stiff island on compliant substrate

Session 16-2-3: Chip-package interactions (Monday, June 4, 3:30-5:30 PM)

Session Chairs: Rui Huang and Ibrahim Bekâr

Paul Ho (UT Austin), Impact of Chip-Packaging Interaction on Interfacial Cracking of Multilevel Cu/Low-k Interconnect Structures (keynote)
Jie-Hua (Jeff) Zhao (TI), Packaging optimization to mitigate stress induced parameter shift in precision devices
Rui Huang (UT Austin), Influence of Interfacial Delamination on Channel Cracking of Brittle Thin Films
Zhenyu Zhang (ORNL), Quantum Stability of Ultrathin Metal Overlayer on Semiconductor Substrates

Session 16-2-7: Metrology for integrated small structures (Tuesday, June 5, 9:45-11:45 AM)

Session Chairs: Rui Huang

Chris Stafford (NIST), Surface Wrinkling as a Metrology Tool (keynote)
Xi Chen (Columbia Univ), Measuring elastoplastic properties of thin films by using nanoindentation
Bin Li (UT Austin), Fabrication and Mechanical Characterization of Silicon Nanolines
Kristen Mills (Univ. Michigan), Nano-cracking of plasma-oxidized polydimethylsiloxane and some of its applications in nano/biotechnology

Session 16-2-5: Mechanics and materials of macroelectrinics (Tuesday, June 5, 1:15-3:15 PM)

Session Chairs: Teng Li

Ananth Dodabalapur (UT Austin), Organic and Polymer Transistors for Flexible Electronics (keynote)
Darran Cairns (West Virginia Univ), Mechanical Studies of Indium Tin Oxide Coated Polymer Films for Flexible Displays
Teng Li (Univ. Maryland), Suitably Patterned Thin Films of Stiff Materials As General Platforms For Flexible Electronics
Hanqing Jiang (Arizona State Univ), Mechanics of Stretchable electronics

Session 16-2-6: Mechanics of integrated MEMS/NEMS (Tuesday, June 5, 3:30-5:30 PM)

Session Chairs: Jun Lou

David Clarke (UC Santa Barbara), The Concurrent Effects of Adhesion, Creep and Roughness on the Propensity for Stiction of Small Scale Mechanical Contacts (keynote)
John X.J. Zhang (UT Austin), Nano Opto-electro-mechanical Characterization of Neuron Membrane Mechanics
Under Growth and Differentiation
Thomas Buchheit (Sandia), Characterizing the Failure Strength and Fatigue Reliability of a Bulk Silicon Micromachining Process
Jun Lou (Rice Univ.), Nanomechanical Testing Using NEMS Devices Based on Suspended Nanotubes/Nanowires

Session 16-2-4: Front-end strain engineering (Wednesday, June 6, 9:45-11:45 AM)

Session Chairs: Dureseti Chidambarrao

Sanjay Banerjee (UT Austin), Strain and Bandgap Engineered High Channel Mobility MOSFETs (keynote)
Klaus Schwarz (IBM), Defect Modeling in the Context of Strain Engineering
Anthony Domenicucci (IBM), Measuring Channel Strain in MOSFET Devices Using TEM Techniques
Jagannathan Rajagopalan (Univ. Illinois), Thermally Activated Plastic Strain Recovery in Freestanding Nanocrystalline Aluminum Thin Films

Session 16-2-8: Defects and reliability of integrated devices (Wednesday, June 6, 1:15-3:15 PM)

Session Chairs: Xiao-Yan Gong and Rui Huang

Zhigang Suo (Harvard), A method to analyze dislocation injection from sharp features
Gang Feng ( Brown Univ.), Modeling Interfacial Misfit Dislocations In A Heteroepitaxial Island
Xiao-Yan Gong (Medical Implant Mechanics LLC), Reliability of Nitinol Stents
Bo Yang (Florida Inst. Of Tech.), Interactive Growth of Delamination and Channel Cracks in Thin Films
Zhen Liu (CCNY), Thin film surface evolution and stress relaxation due to coupled surface and grain boundary diffusion

Session 16-2-9: Self-assembled materials and structures I (Wednesday, June 6, 3:30-5:30 PM)

Session Chairs: Rui Huang and Wei Lu

Martin Dunn (Univ. Colorado), A Computational Design Methodology for Self-Assembled Micro and Nanostructures
Wei Hong (Harvard Univ.), Step dynamics on a silicon surface due to the combined action of strain and electric current
Robert Kukta (SUNY-SB), Self-assembly of Nanostructures on Topographically Pattern Substrates
Long-Qing Chen (Penn State Univ), Phase transitions, domain structures and switching in nanoferroelectrics
Nickolay Shestopalov (UT Austin), Controlled self-assembly: Basic principles and simulations

Session 16-2-10: Self-assembled materials and structures II (Thursday, June 7, 8:30-10:30 AM)

Session Chairs: Wei Lu

Ishwar K. Puri (Virginia Tech), Attributes of self assembly at different length scales: from nano to micro (keynote)
Pradeep Sharma (Univ. of Houston), Engineering Perfect Long Range Order in Self-assembling Nanostructures
Yaoyu Pang (UT Austin), Effect of elastic anisotropy on self-assembly of surface patterns in epitaxial thin films
Cheng-Hsin Chiu (Singapore), The Formation of Nanostructures on the Stranski-Krastanow Systems by Surface Undulation

Session 16-2-11: Self-assembled materials and structures III (Thursday, June 7, 10:45 AM -12:45 PM)

Session Chairs: Wei Lu and Rui Huang

Vivek Shenoy (Brown Univ.), Metastability in 2D Self-Assembling Systems (keynote)
Yong-Wei Zhang (Singapore), Modeling the Growth of Ordered Heteroepitaxial Quantum Dots and Quantum Rings Using Guided Self-Assembly
Wei Lu (Univ. Michigan), Self-assembly of metallic quantum dots on a semiconductor substrate
Gemunu Gunaratne (Univ. Houston), Nanoscale Self-Assembly: A Theoretical Analysis

List of speakers

Rui Huang — Mon, 11 Dec 2006 13:31:07 -0500

Here is an evolving list of speakers who have agreed to present their works at this symposium. I will update this list as we receive more abstracts or informal commitments.

Zhigang Suo, Harvard University
Carl V. Thompson, MIT
David Clarke, University of California at Santa Barbara
Paul Ho, University of Texas at Austin (Interconnects and Packaging)
Martin Gall, Freescale
Jeff Zhao, Texas Instruments
Dureseti Chidambarrao, IBM (CMOS strain engineering)
Klaus Schwarz, IBM (defect strain engineering)
Min Huang, Texas Instruments
Sanjay Banerjee, University of Texas at Austin (Director of Microelectronics Research Center)
John X.J. Zhang, University of Texas at Austin (MEMS/BioMEMS)
Long-Qing Chen, Penn State University (ferroelectric thin films)
David Read, NIST (metrology)
Chris Stafford, NIST (soft materials metrology)
Xi Chen, Columbia University (nanoindentation)
Xiao-yan Gong, Medical Implant Mechanics LLC (medical implants)
Zhenyu Zhang, Oak Ridge National Lab
Taher Saif, University of Illinois
Teng Li, University of Maryland (flexible electronics)
Darran Cairns, West Virginia Univ. (macroelectronics)
Ananth Dodabalapur, University of Texas at Austin (organic electronics)
Hanqing Jiang, Arizona State Univerity (flexible electronics)
Jun Lou, Rice University
Thomas Buchheit, Sandia National Lab (MEMS/NEMS)
Wei Lu, University of Michigan (self assembly)
Ishwar K. Puri, Virginia Tech (self assembly)
Vivek Shenoy, Brown University
Pradeep Sharma, University of Houston
Gemunu Gunaratne, University of Houston
Wei Hong, Harvard Univeristy
Yong-Wei Zhang, National University of Singapore
Cheng-Hsin Chiu, National University of Singapore
Jun He, Intel
Rui Huang, University of Texas at Austin

Symposium on Mechanics of Integrated Structures and Materials in Advanced Technology

Rui Huang — Thu, 30 Nov 2006 18:18:00 -0500

At the 2007 ASME Applied Mechanics and Materials Conference (McMat 2007)

June 3-7, 2007, Austin, Texas

This symposium will provide a forum for the discussions of the latest advances in the cross-disciplinary field of integrated structures, including advanced interconnects for integrated circuits, microelectromechanical systems, and biomedical devices. The key idea is to forge interactions among active researchers from both academia and industries working in the areas of applied mechanics, materials science/engineering, and advanced technologies. Both fundamental research in mechanics and materials and practical applications in advanced technologies are welcome. Topics of interest include, but not limited to:

Mechanics and materials in microelectronics: Cu/low k interconnects, chip-package interaction, and transistor strain engineering
Mechanics of materials in macroelectronics: large-area flexible electronics, organic electronics, thin-film transistors, rollable displays
MEMS/NEMS devices: integration and reliability
Ferroelectric and ferromagnetic thin films: domain structures, multi-field interactions
Integrated biological structures: biomechanics and biomaterials
Biomedical devices: medical implants, etc.
Novel mechanical testing and metrology for integrated small structures
Stress-induced structural evolution and self assembly at micro/nano-scales

Deadline for abstract submission: February 16, 2007.

To submit your abstract, please go to Technical Tracks. Select Track “TK 16 Integrated Structures” and Topic 16-2 for this symposium.

This Symposium is organized by the Technical Committee on Integrated Structures (TCIS) of the ASME Applied Mechanics Division. The committee members include: Ibrahim Bekâr (Intel), Xiaohu Liu (IBM), Dureseti Chidambarrao (IBM), Teng Li (University of Maryland), Jun Lou (Rice University), Wei Lu (University of Michigan), Xi Chen (Columbia University), Xiao-Yan Gong (Medical Implant Mechanics LLC), Jun He (Intel, co-chair), Rui Huang (University of Texas, co-chair).