http://imechanica.org/node/642 Comments for "High ductility of a metal film adherent on a polymer substrate" en http://imechanica.org/node/642#comment-1631 <p>Wish to see more progress from you.</p> <br class="clear" /> Mon, 12 Mar 2007 11:57:52 -0400 Jinglei Yang comment 1631 at http://imechanica.org http://imechanica.org/node/642 <p>In recent development of deformable electronics, it has been noticed that thin metal films often rupture at small tensile strains. Here we report experiments with Cu films deposited on polymeric substrates, and show that the rupture strains of the metal films are sensitive to their adhesion to the substrates. Well-bonded Cu films can sustain strains up to 10% without appreciable cracks, and up to 30% with discontinuous microcracks. By contrast, poorly bonded Cu films form channel cracks at strains about 2%. The cracks form by a mixture of strain localization and intergranular fracture. The films rupture at large strains when the localization is retarded by the adherent substrates.</p> <p><a href="/user/44">Yong Xiang</a>, <a href="/user/10">Teng Li</a>, <a href="/user/2">Zhigang Suo</a>, and <a href="/user/12">Joost J. Vlassak</a>, &quot;High ductility of a metal film adherent on a polymer substrate&quot;, <em>Applied Physics Letters</em>,<strong>87</strong>, 161910 (2005).</p> <p><strong>Related posts and discussions</strong> </p> <p><a href="/node/592">Tension of Cu film on Pi substrate </a><a href="/644"></a></p> <p><a href="/644">Local thinning of Cu film</a></p> <p><a href="/644">Delocalizing Strain in a Thin Metal Film on a Polymer Substrate</a> </p> <br class="clear" /> http://imechanica.org/node/642#comments research deformable eclectronics fracture high ductility thin films Tue, 02 Jan 2007 18:46:02 -0500 Yong Xiang 642 at http://imechanica.org