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Packaging Mechanical Engineer at Hopewell Junction, NY, IBM Microelectronics Division

Xiao Hu Liu's picture

Packaging mechanical engineers conduct simulation of electronic packages
to optimize package design for compatibility with assembly processes
and for reliable operation in end user systems such as servers, game
consoles and network switches. Simulation is conducted using commercial
finite element software such as ANSYS or ABAQUS to predict package
component stresses and strains. Simulations are verified by measurements
of warpage and stresses / strains in the packages using Digital image
contrast, strain gages, capacitance meters, etc. Package material
properties such as coefficient of thermal expansion, Poisson ratio and
modulus that are required for simulation are measured using specialized
mechanical equipment. Thus, familiarity with numerical simulation
techniques and mechanical measurement equipment is required. The
successful candidate will have an opportunity to participate in
leading-edge technology development for the most complex processor
packages in the industry.

If you are interested, apply at the following link.

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