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An apparatus for performing microtensile tests at elevated temperatures inside a scanning electron microscope

Gi-Dong Sim's picture

In this paper, we introduce an apparatus to perform microtensile tests at elevated temperatures inside a scanning electron microscope. The apparatus has a stroke of 250 μm with a displacement resolution of 10 nm and a load resolution of 9.7 μN. Measurements at elevated temperatures are performed through use of two silicon-based micromachined heaters that support the sample. Each heater consists of a tungsten heating element that also serves as a temperature gauge. To demonstrate the testing capabilities, tensile tests were performed on submicron Cu films at various temperatures up to 430 °C. Stress–strain curves show a significant decrease in yield strength and initial slope for the samples tested at elevated temperature, which we attribute to diffusion-facilitated grain boundary sliding and dislocation climb.

The paper has been published in Acta Materialia and can be downloaded from: 

http://www.sciencedirect.com/science/article/pii/S1359645413006708# 

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