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SES 2008 Technical Meeting at the University of Illinois

Harley T. Johnson's picture

We are pleased to announce that the 2008 Society of Engineering Science (SES) Annual Technical Meeting will be held at the University of Illinois at Urbana-Champaign on October 12-15, 2008.  The meeting will feature themes in Solid and Fluid Mechanics; Biomechanics; Physics, Chemistry & Biology in Engineering; and Applied Mathematics.  The members of the local organizing committee, including faculty from the new Department of Mechanical Science & Engineering, the Department of Aerospace Engineering, the Department of Civil & Environmental Engineering, and the Department of Materials Science & Engineering, cordially invite you to make plans to attend this exciting conference.  More information is available at the conference website: http://ses2008.mechse.uiuc.edu/.  Individuals interested in organizing symposia at the conference should contact the organizers at ses2008mechse@uiuc.edu.

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