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[Call for Abstract] SES 2016 Symposium D-3: Mechanics of 3D Printed Materials and Structures

Sung Hoon Kang's picture

We would like to invite you to submit an abstract to the symposium on Mechanics of 3D Printed Materials and Structures at the 53rd Annual Technical Meeting of the Society of Engineering Science (SES2016) to be held during October 2-5, 2016 at the College Park Marriott Hotel & Conference Center (College Park, MD). 

Symposium Technical Description

Additive manufacturing, also known as 3D printing, offers unique opportunities to explore novel properties and mechanics of materials and structures. This symposium calls abstracts from research efforts related to materials and structures with novel mechanical properties/behaviors realized using 3D printing techniques. Specific topics of interest include, but not limited to:

  • Metamaterials with novel properties, such as acoustic properties, negative Poisson’s ratio, etc.
  • Printed active composites that achieve its actuation through spatially controlling the allocation of active materials
  • Novel 3D printing methods that provide unique behaviors/functionalities including stimuli-responsive behaviors
  • Design theory or methodology for materials and structures that will be realized through 3D printing
  • Mechanics of 3D printed materials, such as their constitutive behaviors, fracture behaviors
  • Applications of 3D printed materials and structures

Please be reminded to submit your abstract by June 15, 2016 to Symposium D-3: Mechanics of 3D Printed Materials and Structures to participate in our symposium. Abstract sumission is currently open. You can submit your abstract(s) through the following page (https://www.tavatta.com/cms/index.php?conference=ses&schedConf=ses2016).

Should you have any questions, please feel free to contact us. Thank you for your consideration.

Symposium Organizers:

Sung Hoon Kang, Johns Hopkins University
shkang@jhu.edu

Howon Lee, Rutgers University
howon.lee@rutgers.edu

Yaning Li, University of New Hampshire
yaning.li@unh.edu

Jerry Qi, Georgia Institute of Technology
qih@me.gatech.edu

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