User login

You are here

Call for Abstracts: SES2016 Symposium D-6: Advanced Instrumentation and Fabrication Techniques for the Measurement of Mechanical and Physical Properties of Solids and Structures

Gi-Dong Sim's picture

Dear Colleagues,

The 53rd Annual Technical Meeting of the Society of Engineering Science (SES2016) will be hosted by the University of Maryland (UMD) during 2-5 October 2016 at the College Park Marriott Hotel & Conference Center. 

We would like to invite you to submit abstracts for our symposium entitled “Advanced Instrumentation and Fabrication Techniques for the Measurement of Mechanical and Physical Properties of Solids and Structures”

This symposium will focus on sharing new instrumentation and fabrication techniques to measure properties of materials/structures at different length scales, loading, and environment conditions.

Topics in this symposium will include but are not limited to the: (a) design and manufacture of custom loading frames; (b) advanced fabrication of sensors and actuators to measure mechanical and physical properties of materials; (c) mechanical and physical properties of small-scale materials in extreme environments; and (d) reliability studies of applied materials embedded in complex structures.

We anticipate the speakers to convey new ideas and to interact with the audience by sharing experiences in overcoming the technical challenges in their research.

http://ses2016.org/symposium-d-6-advanced-instrumentation-and-fabricatio...

 

Best regards,

Symposium Organizers

Joost Vlassak, Harvard University (vlassak@seas.harvard.edu)

Chris Eberl, Fraunhofer Institute for Mechanics of Materials (chris.eberl@iwm.fraunhofer.de)

Samantha Daly, University of Michigan (samdaly@umich.edu)

Gi-Dong Sim, Johns Hopkins University (gdsim@jhu.edu)

Subscribe to Comments for "Call for Abstracts: SES2016 Symposium D-6: Advanced Instrumentation and Fabrication Techniques for the Measurement of Mechanical and Physical Properties of Solids and Structures"

Recent comments

More comments

Syndicate

Subscribe to Syndicate