Call for Abstracts (IMECE): 3D Printed Soft Materials

Dear Colleagues,

We would like to invite you to submit an abstract to the session on 3D Printed Soft Materials at the ASME 2016 IMECE to be held from November 11 to November 17, 2016 in Phoenix, AZ.

Deadline for abstract submission is July 15th.

Additive manufacturing, also known as 3D printing, offers unique opportunities to explore novel properties and mechanics of soft materials. This session calls papers from research efforts related to soft materials with novel properties realized or created using 3D printing techniques. Specific topics of interest include, but not limited to

-  Soft metametarials with novel properties, such as acoustic properties, negative Poisson’s ratio, etc.

-  Printed active composites that achieve its actuation through spatially controlling the allocation of soft active materials

-  Novel printing technologies with improved accuracy or with new printable materials

-  Design theory or methodology for soft materials that will be realized through 3D printing

-  Mechanics of 3D printed materials, such as their constitutive behaviors and fracture behaviors

-  Applications of printed soft materials 

 Here are a few key points about submitting abstracts:- Please submit your abstract to 12-51: Mechanics of Soft Materials. ("3D Printed Soft Materials” session belongs to this topic.)- Please include a statement at the end of their abstract “This abstract is intended for the 3D Printed Soft Materials session.” This will allow us to easily and quickly assigne your abstract into our session.- Abstracts should be at least 400 words.

- Use the same email address for abstract submission and registration. 

- You can submit your abstract online here: http://www.asmeconferences.org/IMECE2016/Author/NewAbstract.cfm

Please feel free to contact [ howon.lee at rutgers.edu ] if you have any question. Thank you for your consideration.

Symposium co-organizers

Howon Lee, Rutgers University

Jerry Qi, Georgia Institute of Technology

Sung Hoon Kang, Johns Hopkins University

Yaning Li, University of New Hampshire

Stephan Rudykh, Technion