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Call for Abstract Submission to the USNCCM14: Modeling Materials with Coupled Physics

sergkuznet's picture

Dear Colleagues:

The 14th U.S. National Congress on Computational Mechanics (USNCCM14) will be held at the Palais des Congrès de Montréal, QC, Canada,  July 17-20, 2017 (http://14.usnccm.org/).

As a part of this meeting, we are organizing a mini-symposium to address recent advances in Modeling Materials with Coupled Physics (http://14.usnccm.org/MS709). Topics of particular interest include (but not limited to)

  • Electroactive and magnetoactive materials
  • Shape-memory and light-sensitive polymers
  • Design of microstructured and functional materials
  • 3D printing and additive manufacturing
  • Computational homogenization and multiscale modeling
  • Design and modeling of metamaterials

We cordially invite you to submit your abstract for this mini-symposium. To submit an abstract, please visit the conference website http://14.usnccm.org/abstract_instructions .
The deadline for abstract submission is 
February 28, 2017

We are looking forward to your presentations at this mini-symposium.

With our best regards,

Stephan Rudykh, Technion – Israel Institute of Technology

Sergey Kuznetsov, North Carolina State University 

 

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