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WCCM 2018 mini-symposium 410: Mechanics of Soft Materials with Multi-physics: From Deformation to Failure

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Dear Colleagues,

We would like to invite you to submit an abstract to our symposium titled “410 Mechanics of Soft Materials with Multi-physics: From Deformation to Failure” as part of The 13th World Congress in Computational Mechanics (New York City, NY, July 22-27, 2018).

The deadline for abstract submission is  December 31, 2017.

Information on submitting an abstract may be found at:  http://www.wccm2018.org/abstract-submission

We are looking forward to seeing you in New York City.

 

Kind regards,

 

Shenghua Wu, MIT & FEUP

Yunwei Mao, MIT

Francisco Manuel Andrade Pires, University of Porto

Changyong Cao, Michigan State University

 

Session Description:

The continuing revolution in the development of soft materials is transforming the engineering of devices. In many applications, harnessing the potential of soft materials hinges on whether mechanical behaviors, including but not limited to deformation and failure, can be understood, prevented or controlled. In contrast to hard materials, in soft devices the length scale of fracture-type processes is often comparable to the structural dimensions, and thus fracture cannot be decoupled from the rest of the response. Additionally, the presence of competing complex responses, e.g., the Mullins effect, viscous flow, solvent diffusion and reaction, multiscale instabilities, formation and breaking of temporary bonds complicate the picture, but also provide opportunities to tailor performance of materials in new ways. Analyzing these phenomena requires the development of new modeling and computational approaches and techniques.

Specifically, for computational aspect, such as multi-physics fields coupling, phase field modeling, XFEM approach, faster methods for solving discretized equations, adaptation of the numerical codes to parallel computation, are in need. These developments play a central role in advancing the understanding of mechanical and physical behavior of soft materials. Therefore, a Mini-Symposium on mechanic of soft materials is a timely concern. The aim is to provide an exposition of the current state of the art and a survey about recent developments and to create perspectives for future research trends.

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