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Call for Abstract Submission to the WCCM 2018: 412 Modeling and Design of Materials with Coupled Physics

sergkuznet's picture

Dear Colleagues:

13th World Congress in Computational Mechanics (WCCM XIII2018) and 2nd Pan American Congress on Computational Mechanics (PANACM II) will be held at Mariott Marquis in New York City, NY on July 22-27, 2018 (

As a part of this meeting, we are organizing a mini-symposium to address recent advances in Modeling and Design of Materials with Coupled Physics: 412 Modeling and Design of Materials with Coupled Physics (

 Functional materials is a rapidly growing field of study in computational mechanics community. The multiphysics nature of functional materials poses multiple challenges in modeling and engineering of architectured materials with new functionalities. Recent advances in material manufacturing (such as 3D, 3D weaving) open an exciting opportunity to realize and test pre-designed materials with desirable functionalities.

 This session aims to bring together experts in modeling, simulations, design, manufacturing, processing and experimentations in the field of functional materials both from academia and industry to present and discuss recent advances.


Topics of particular interest include(but not limited to):

 • Materials with electro- and magneto-mechanical coupling

• Thermoelectric materials

• Woven and braided materials

• Shape-memory and light-sensitive polymers

• Advanced steels and alloys

• Locally resonant materials

• Functionally graded materials

• Computational homogenization and multiscale modeling

• Properties identification from experimental data and computational analysis of image-based and synthetic microstructure

• Design of microstructured and functional materials

• Additive manufacturing


We cordially invite you to submit your abstract for this mini-symposium. The abstract submission will be open until December 31, 2017.

To submit an abstract, please visit the congress website at

We are looking forward to your presentations at this mini-symposium.


With our best regards,

Sergey Kuznetsov, North Carolina State University

Stephan Rudykh, Technion – Israel Institute of Technology

Konstantin Redkin, University of Pittsburgh, WHEMCO Inc

Mahesh Raju Bailakanavar, Thornton Tomasetti, Weidlinger Applied Science Practice

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