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Summer Internship (US Ph.D. candidate of Mechanical / Materials Science and Engineering)

Soud Choudhury's picture

Hi, we are looking for a Summer Intern at the Chandler Site of Intel Corporation. Please, see below the information and contact me if you are a great fit.

Thank you - Soud

Package FA intern

Responsibilities include but are not be limited to:

- EBSD statistical analysis on Cu and solder grain structures and orientation textures;

- Metallography sample preparation for SEM/EBSD observations;

- Work with Physical Failure Analysis teams on electronic packaging failure mechanisms;

The ideal candidate will exhibit the following behavioral traits:
- Strong analytical problem solving, teamwork, effective oral and written communication skills.
- Passionate about hands-on, lab-oriented environment.
- Ability to work well in ambiguous situations. Mature, self-assured, well organized.

You must possess the below minimum qualifications to be initially considered for this position. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences
Minimum Qualifications:
- The candidate must be a Ph.D. candidate in material sciences or related areas;

Preferred Qualifications:
*Hands-on experiences on EBSD, SEM and sample preparation;

*Research experiences on interconnects of advanced electronic packaging, including studies on solder joint;

Comments

Hi Soud,

My PhD thesis topic is on the operation and damage of low volume solder interconnections for 3DIC packaging systems, and I am in my third year of PhD studies, here at Texas A&M University. Could you please let me know how can I apply?

email: attari.v@tamu.edu

Vahid

 

 

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