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2018 ASME IMECE (Topic 12-31) Mechanical Metamaterials

jminshim's picture

Dear Colleagues,

This is a gentle reminder that abstracts are due on July 23d for the mini-symposium entitled “Mechanical Metamaterials(12-31)” at ASME IMECE 2018 (https://www.asme.org/events/imece) to be held from November 9-15 in Pittsburgh, PA.  I would like you to consider submitting abstracts. The following is the description of the symposium and the potential topics to cover. 

PURPOSE AND SCOPE

Mechanical metamaterials are the rationally designed artificial structures whose properties are not found in nature. The properties of mechanical metamaterials are defined by their geometric architecture guided by design rather than their composition. 

This symposium invites fundamental studies on mechanics and design of architectured structures and their engineering applications. The aim of this session is to provide a forum to bring together investigators to discuss and disseminate the research findings on mechanical metamaterials.  Examples of topics in this symposium include (but are not limited to):

• Reconfigurable mechanical metamaterials, tunable mechanical metamaterials, and mechanics of mechanical metamaterials.
• The design of mechanical metamaterials on negative Poisson’s ratio, negative thermal expansion, negative stiffness, negative compressibility, reverse Saint-Venant effect, and other tailored engineering properties.
• Analytical, numerical, and experimental studies on the behaviors of architected structures; e.g., polygon/polyhedral lattices, tessellated structures, granular structures, tensegrity lattices, origami/kirigami structures, etc.
• Added intelligent design with programmable functions to achieve particular shapes or mechanical properties upon command.
• Advanced technologies such as 3D/4D printing to manufacture mechanical metamaterials.

I hope you will join us for this symposium. Thank you.

Session Organizers:
Jongmin Shim, University at Buffalo, USA, jshim@buffalo.edu
Eduard Karpov, University of Illinois at Chicago, USA, ekarpov@uic.edu
Jie Yin, Temple University, USA, jieyin@temple.edu
Yaning Li, University of New Hampshire, USA, Yaning.Li@unh.edu
Sung Hoon Kang, Johns Hopkins University, USA, shkang@jhu.edu
Lifeng Wang, Stony Brook University, USA, Lifeng.Wang@stonybrook.edu
Jaehyung Ju, Shanghai Jiao Tong University, China, jaehyung.ju@sjtu.edu.cn

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