As part of the 2008 ASME International Mechanical Engineering Congress and Exposition (IMECE), this symposium is being organized by Technical Committee of Integrated Structures (TCIS) of the ASME
Applied Mechanics Division (AMD).

When and Where: October 31 - November 6, 2008, Boston, Massachusetts.

Abstract submission deadline: March 3, 2008 

To submit your abstracts to this symposium, select Track 11 (Mechanics of Solids, Structures and Fluids) and Topic 11-2.

Description:

This symposium will provide a forum for the discussions of
the latest advances in the cross-disciplinary field of integrated structures,
including advanced interconnects for integrated circuits, micro/nano
electromechanical systems, and biomedical devices. The objective is to forge
interactions among active researchers from both academia and industries working
in the areas of applied mechanics, materials science/engineering, and advanced
technologies. Both fundamental research in mechanics and materials and
practical applications in advanced technologies are welcome.

Topics and organizers:

·          
Mechanics of
materials in microelectronics (Jun he, Intel)

·          
Mechanics of flexible electronics (Teng Li, U. Maryland)

·          
Mechanical measurements in integrated small structures
(Jun He, Intel)

·          
Mechanics of molecular and biological structures (Xi Chen, Columbia
University)

·          
Mechanics
of metamaterials for acoustic and optic applications (Martin Dunn, University of
Colorado at Boulder)

·          
Mechanics of multifunctional and smart materials (Chad Landis, University of Texas at Austin)

·          
Mechanics and materials in energy systems (Xiaodong Li, University of South Carolina)

·          
Nanofabricaition and self assembly (Wei Lu, University of Michigan)