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Symposium on Mechanics of Integrated Structures and Materials in Advanced Technology
At the 2007 ASME Applied Mechanics and Materials Conference (McMat 2007)
June 3-7, 2007, Austin, Texas
This symposium will provide a forum for the discussions of the latest advances in the cross-disciplinary field of integrated structures, including advanced interconnects for integrated circuits, microelectromechanical systems, and biomedical devices. The key idea is to forge interactions among active researchers from both academia and industries working in the areas of applied mechanics, materials science/engineering, and advanced technologies. Both fundamental research in mechanics and materials and practical applications in advanced technologies are welcome. Topics of interest include, but not limited to:
- Mechanics and materials in microelectronics: Cu/low k interconnects, chip-package interaction, and transistor strain engineering
- Mechanics of materials in macroelectronics: large-area flexible electronics, organic electronics, thin-film transistors, rollable displays
- MEMS/NEMS devices: integration and reliability
- Ferroelectric and ferromagnetic thin films: domain structures, multi-field interactions
- Integrated biological structures: biomechanics and biomaterials
- Biomedical devices: medical implants, etc.
- Novel mechanical testing and metrology for integrated small structures
- Stress-induced structural evolution and self assembly at micro/nano-scales
Deadline for abstract submission: February 16, 2007.
To submit your abstract, please go to Technical Tracks. Select Track “TK 16 Integrated Structures” and Topic 16-2 for this symposium.
This Symposium is organized by the Technical Committee on Integrated Structures (TCIS) of the ASME Applied Mechanics Division. The committee members include: Ibrahim Bekâr (Intel), Xiaohu Liu (IBM), Dureseti Chidambarrao (IBM), Teng Li (University of Maryland), Jun Lou (Rice University), Wei Lu (University of Michigan), Xi Chen (Columbia University), Xiao-Yan Gong (Medical Implant Mechanics LLC), Jun He (Intel, co-chair), Rui Huang (University of Texas, co-chair).
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List of speakers
Here is an evolving list of speakers who have agreed to present their works at this symposium. I will update this list as we receive more abstracts or informal commitments.
RH
Integrated Structures Symposium at McMat 2007
The technical program of this symposium is now finalized as follows.
Session 16-2-1: Cu/low k interconnects I (Monday, June 04, 09:45-11:45 AM)
Session Chairs: Jun He and Rui Huang
Session 16-2-2: Cu/low k interconnects II (Monday, June 04, 1:15-3:15 PM)
Session Chairs: Jun He and Rui Huang
Session 16-2-3: Chip-package interactions (Monday, June 4, 3:30-5:30 PM)
Session Chairs: Rui Huang and Ibrahim Bekâr
Session 16-2-7: Metrology for integrated small structures (Tuesday, June 5, 9:45-11:45 AM)
Session Chairs: Rui Huang
Session 16-2-5: Mechanics and materials of macroelectrinics (Tuesday, June 5, 1:15-3:15 PM)
Session Chairs: Teng Li
Session 16-2-6: Mechanics of integrated MEMS/NEMS (Tuesday, June 5, 3:30-5:30 PM)
Session Chairs: Jun Lou
Under Growth and Differentiation
Session 16-2-4: Front-end strain engineering (Wednesday, June 6, 9:45-11:45 AM)
Session Chairs: Dureseti Chidambarrao
Session 16-2-8: Defects and reliability of integrated devices (Wednesday, June 6, 1:15-3:15 PM)
Session Chairs: Xiao-Yan Gong and Rui Huang
Session 16-2-9: Self-assembled materials and structures I (Wednesday, June 6, 3:30-5:30 PM)
Session Chairs: Rui Huang and Wei Lu
Session 16-2-10: Self-assembled materials and structures II (Thursday, June 7, 8:30-10:30 AM)
Session Chairs: Wei Lu
Session 16-2-11: Self-assembled materials and structures III (Thursday, June 7, 10:45 AM -12:45 PM)
Session Chairs: Wei Lu and Rui Huang
This looks like a great symposium on integrated structures
Rui: This is very well organized and I'm looking forward to the symposium. Thank you and your co-organizers for getting people together.