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The 2007 Melosh Medalists

The 19th Annual Melosh Competition for the Best Student Paper in Finite Element Analysis was held last Friday, April 27, at ETH Zurich. Two medalists were selected this year from the six finalists. The 2007 Melosh Medalists are Vikram Gavini, from Caltech, and Michael Hain, from Leibniz University, Hannover.

Zhigang Suo's picture

David Turnbull died on 28 April 2007

David Turnbull died peacefully at home last Saturday, April 28th, at age 92.

He was for many years Gordon McKay Professor of Applied Physics at Harvard University. His seminal work included theoretical and experimental studies of nucleation of crystals, the glass transition and the amorphous state, crystal growth, and atomic diffusion.

Xiaodong Li's picture

Journal Club Theme of May 2007: Experimental Mechanics of Nanobuilding Blocks

Welcome to the May 2007 issue. This issue focuses on experimental nanomechanics of nanobuilding blocks. The extremely small dimensions of nanobuilding blocks (for instance, nanoparticles, nanotubes, and nanowires) have imposed great challenges to many existing instruments, methodologies, and even theories.  In this issue, we will discuss – (1) experimental techniques and (2) size-effects. 

Super stretchy carbon nanotubes

Huang et al., PRL 98, 185501 (2007)

Watch movies at:

We report exceptional ductile behavior in individual double-walled and triple-walled carbon nanotubes at temperatures above 2000 C, with tensile elongation of 190% and diameter reduction of 90%, during in situ tensile-loading experiments conducted inside a high-resolution transmission electron microscope. Concurrent atomic-scale microstructure observations reveal that the superelongation is attributed to a high temperature creep deformation mechanism mediated by atom or vacancy diffusion, dislocation climb, and kink motion at high temperatures. The superelongation in double-walled and triple-walled carbon nanotubes, the creep deformation mechanism, and dislocation climb in carbon nanotubes are reported here for the first time.

Henry Tan's picture

Surface roughness evolution

With a shallow chemical etching the roughness with spatial frequency below a critical value grows while the roughness of higher frequency decays.


Ken P. Chong's picture

NSF Proposal Writing Workshop

Subject: NSF Proposal Writing Workshop ( August 22-23, 2007 - Alaska)

Sponsored by NSF, a Proposal Writing Workshop will be held on August 22-23, 2007, at University of Alaska-Fairbanks. The workshop mainly aims to provide future proposal submitters (in all disciplines funded by NSF) with knowledge and tools to write good proposals, proposal review experience, and it will enable interactions with NSF program directors and recent NSF awardees. The event is targeted at an EPSCoR state, Alaska. However, the workshop is open to participants from other states as space permits.

MichelleLOyen's picture

Adhesion in viscoelastic contacts

Yesterday I had the distinct pleasure of seeing a mechanics seminar delivered "tag-team" by Ken Johnson and Jim Greenwood. (I know several people have thought I was a bit mad for jumping "across the pond" but there are really some amazing benefits of being part of the Cambridge Engineering faculty!)

Mogadalai Gururajan's picture

Going beyond 2D Neumann-Mullins (or, what is popularly known as, solving the beer froth structure)


The blogosphere is abuzz with the latest report of the generalisation of the von Neumann-Mullins grain growth relation to 3 (and N) dimensions by MacPherson and Srolovitz (As an interesting aside, almost all the reports say mathematical structure of beer foam structure resolved, or words to that effect --hence, I also decided to join the bandwagon on that one). I heard Prof. Srolovitz describe the work in a seminar nearly six months ago. Based on my notes of the talk, I would like the explain their work in this post. Curvature in the following refers to mean curvature (and not Gaussian).

Microcantilever operated in liquid environment for in-vitro biomolecular detection

We have recently reported the piezoelectric thick film microcantilever, which enables the in-situ real-time detection of the protein related to disease (e.g. C reactive protein) in liquid environment. This work was published at APL (click here).

Mogadalai Gururajan's picture

Sample issue of Journal of Materials, a TMS publication

JOM is a monthly publication of TMS--The minerals, metals, and materials society. It covers a wide range of materials topics. I expecially like the overview articles, which, in four or five pages pack lots of information. Further, the historical articles about metallurgy and materials in ancient civilizations will interest those of you who like to read about history in general, and science history, in particular.

Chip-package interaction and interfacial delamination

In flip-chip package, the mismatch of thermal expansion coefficients between the silicon die and packaging substrate induces concentrated stress field around the edges and corners of silicon die during assembly, testing and services. The concentrated stresses result in delamination on many interfaces on several levels of structures, in various length scales from tens of nanometers to hundreds of micrometers. A major challenge to model flip-chip packages is the huge variation of length scales, the complexity of microstructures, and diverse materials properties. In this paper, we simplify the structure to be silicon/substrate with wedge configuration, and neglect the small local features of integrated circuits. This macroscopic analysis on package level is generic with whatever small local features, as long as the physical processes of interest occur in the region where the concentrated stress field due to chip-packaging interaction dominates. Because it is the same driving force that motivates all of the flaws. Therefore, the different interface cracks with same size and same orientation but on different interfaces should have similar energy release rates provided that the cracks are much smaller than the macroscopic length. We calculate the energy release rate and the mode angle of crack on the chip-package interface based on the asymptotic linear elastic stress field. In a large range of crack length, the asymptotic solution agrees with finite element calculation very well. We discuss the simplified model and results in context of real applications. In addition, we find that the relation of energy release rate G and crack length a is not power-law since local mode mixity is dependent of crack length a. Therefore, the curve of G~a can be wavy and hardly goes to zero even if crack length a goes to atomically small. The local mode mixity plays an important role in crack behavior.

Robert Paynter's picture

iMechanica needs a logo

I agree with Michelle, we need to get beyond the default Drupal water drop.

How about my little offering, that came to mind:


It's overall shape approximates that of the letter i

At a glance it can look like a Mass on a Spring - major components of mechanics.

It has a globe because this is international

and it says iMechanica at the bottom.

Sure, it need some polishing, but perhaps offers a start.


Oxford, UK

Taxonomy upgrade extras: 
zhan-sheng guo's picture

ICNM 2007

The International Conferences on Nonlinear Mechanics (ICNM-x) have been regarded as important series conferences in mechanics circles. The previous four meetings in the series were successfully held in Shanghai and Beijing in 1985, 1993, 1998 and 2002, respectively. In recent years, new achievements in this field have been made. Therefore, it is appropriate to organize a new conference on this vitally important area of applied mathematics and mechanics. The Fifth International Conference on Nonlinear Mechanics (ICNM-V) will be held in Shanghai. The Conference aims to provide an international forum for presenting the latest results and stimulating wider academic exchange for experts in the related fields all over the world.

Marek-Jerzy Pindera's picture

In Memory of Professor Liviu Librescu

I had known Liviu since his early days in the Engineering Science and Mechanics Department at Virginia Tech when I was just beginning my own academic career. I had received my PhD from this department in 1981 in an area (composite materials) that at the time was at the cutting edge of high technology. In 1985 I had come back to VA Tech from the industry to continue working in this exciting area in which the ESM Department excelled world-wide. Liviu had arrived shortly thereafter with an already established reputation as a top-notch scientist.

Xuanhe Zhao's picture

Electromechanical hysteresis and coexistent states in dielectric elastomers

Active polymers are being developed to mimic a salient feature of life: movement in response to stimuli. Large deformation can lead to intriguing phenomena; for example, recent experiments have shown that a voltage can deform a layer of a dielectric elastomer into two coexistent states, one being flat and the other wrinkled. This observation, as well as the needs to analyze large deformation under diverse stimuli, has led us to reexamine the theory of electromechanics.

Simulating explosions

Recently Henry talked about software that could be used to simulate explosions and introduced CartaBlanca. Luming asked whether anyone had used the software, how good it was, and whether one needed Java to implement models into CartaBlanca.

Ying Li's picture



Mogadalai Gururajan's picture

Computer simulations and visualization: Seed video

Here is a video from the Seed magazine called Science in Silico. The video shows results from large scale simulations (and visualization) of fractals, microscopic dynamic processes in ribosomes, structure of viruses, bacterial flagellum, turbulence, explosions, and the modelling of cosmological events.

Teng Li's picture

iMechanica now has 2000+ registered users

iMechanica was lunched on 9 September 2006. It took about five months for iMechanica to see its 1000th registered user. Today we are welcoming the 2000th registered user after only another two and half months.

MichelleLOyen's picture

New Micromechanics Book

This message about a new book came over the PoroNet (poroelasticity network) mailing list:

Dear Colleagues:

      I would like to inform you that my book "Micromechanics of Heterogeneous Materials” (containing around 700 pages, 140 figures, 3000 formulae, and 1200 references) should be published by Springer on 07.06.07. [Details are on the web|toc ] .

      In the framework of a unique scheme of the proposed multiparticle effective field method, we have undertaken in this book an attempt to analyze the wide class of statical and dynamical, local and nonlocal, linear and nonlinear multiscale problems of composite materials with deterministic (periodic and nonperiodic), random (statistically homogeneous and inhomogeneous, so-called graded) and mixed (periodic structures with random imperfections) structures in bounded and unbounded domains, containing coated or uncoated inclusions of any shape and orientation and subjected to coupled or uncoupled, homogeneous or inhomogeneous external fields of different physical natures.

        Any the remarks and comments regarding the book will be fully appreciated.

Fang Wang's picture


The present paper studies the effect of intracranial temperature (ICT) change on intracranial pressure (ICP). Thermal and mechanical effects were analyzed using a 3D finite element model of the human head.


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