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SES2016

Teng Li's picture

Meet the Editors-in-Chief of Mechanics Journals at SES2016: An Open Forum

The advent of internet era has been driving some significant changes in scientific publication process. The needs for optimizing publication process, from manuscript preparation and submission, to review process and to post-publication dissemination, are ubiquitous for many disciplines. There is no exception for the mechanics field.  

Teng Li's picture

SES2016 goes mobile!

Dear colleages,

Teng Li's picture

SES2016: Banquet plenary speaker announced

Dear Colleagues, 

We are pleased to announce that Dr. Mihail C. Roco of National Science Foundation and National Nanotechnology Initiative will be the SES2016 banquet plenary speaker. 

Nanotechnology and Other Grand Challenges in the United States

Mihail C. Roco

Teng Li's picture

SES2016 Technical Program is now available online

 

Dear colleagues,

We are pleased to announce that the technical program of the 53rd Annual Technical Meeting of the Society of Engineering Science (SES2016) is now available online at 

http://ses2016.org/tracks-symposia/

(Click the link to individual symposia for detailed technical program)

Teng Li's picture

SES2016 is open for registration

Dear colleagues:

We are pleased to announce that the 53rd Annual Technical Meeting of the Society of Engineering Science (SES2016) is now open for registration at

http://ses2016.org/home/registration/

 

We look forward to seeing you at the University of Maryland, College Park in October!

Teng and Abhijit

Nanshu Lu's picture

Call For Abstracts: 2016 SES Symposium D-12 Mechanics, Materials, and Manufacture of Flexible and Stretchable Electronics

Dear colleagues,

You are cordially invited to submit abstract(s) to Symposium D-12 Mechanics, Materials, and Manufacture of Flexible and Stretchable Electronics at the 2016 SES meeting to be held at the University of Maryland-College Park during October 2-5, 2016. Abstracts can not be more than 350 words and are due on Wednesday, June 15, 2016.

Teng Li's picture

SES2016: List of Confirmed Invited Speakers (as of 11 June 2016)

Dear colleagues,

The 53rd Annual Technical Meeting of the Society of Engineering Science (SES2016) will be hosted by the University of Maryland (UMD) during 2-5 October 2016 at the College Park Marriott Hotel & Conference Center.  

Gi-Dong Sim's picture

Call for Abstracts: SES2016 Symposium D-6: Advanced Instrumentation and Fabrication Techniques for the Measurement of Mechanical and Physical Properties of Solids and Structures

Dear Colleagues,

The 53rd Annual Technical Meeting of the Society of Engineering Science (SES2016) will be hosted by the University of Maryland (UMD) during 2-5 October 2016 at the College Park Marriott Hotel & Conference Center. 

We would like to invite you to submit abstracts for our symposium entitled “Advanced Instrumentation and Fabrication Techniques for the Measurement of Mechanical and Physical Properties of Solids and Structures”

Cai Shengqiang's picture

CALL FOR ABSTRACT: SES Symposium C-4: Mechanical Characterization of Soft Materials: Experiments and Modeling

Soft materials are ubiquitous in nature, from biopolymers, cells, and tissues to organs. In recent years, soft materials have been intensively explored in different engineering applications, ranging from haptic devices to soft robotics, from flexible electronics to biomimetic systems. Fundamental studies of the deformation mechanisms of soft materials and optimal designs in different applications urgently need robust methods for material characterization.

ahmedettaf's picture

[Call for Abstracts] SES minisymposium on Friction, Fracture, and Damage

Dear Colleagues,

We would like to invite you to consider submitting abstracts to the following minisymposium taking place as part of the Soceity of Engineering Sciences meeting to be hosted by the University of Maryland (October 2-5, 2016)

D-9 :Friction, Fracture and damage (http://ses2016.org/symposium-d-9-friction-fracture-and-damage/)

Shuze Zhu's picture

[Call for Abstract] SES 2016 Symposium E-5: Mechanics of Multifunctional 2D materials and 2D-based Nanostructures

We would like to invite you to submit abstracts to the symposium of Mechanics of Multifunctional 2D materials and 2D-based Nanostructures at the 53rd Annual Technical Meeting of the Society of Engineering Science (SES 2016) to be held at University of Maryland College Park (October 2-5, 2016).

Symposium Description

Teng Li's picture

SES2016: Call for Abstract Submissions

Dear Colleagues,

The 53rd Annual Technical Meeting of the Society of Engineering Science (SES2016) will be hosted by the University of Maryland (UMD) during 2-5 October 2016 (note the new conference date) at the College Park Marriott Hotel & Conference Center.  

Zheng Jia's picture

[Call for Abstract] SES 2016 Symposium E-1: Mechanics and Electrochemistry of Energy Materials

We would like to invite you to submit abstracts to the symposium on Mechanics and Electrochemistry of Energy Materials at the 53rd Annual Technical Meeting of the Society of Engineering Science (SES 2016) to be held at University of Maryland College Park (October 2-5, 2016).

Symposium Description

Teng Li's picture

SES2016 is open for abstract submission

Dear Colleagues,

The 53rd Annual Technical Meeting of the Society of Engineering Science (SES2016) will be hosted by the University of Maryland (UMD) during 2-5 October 2016 at the College Park Marriott Hotel & Conference Center.  

Teng Li's picture

SES2016: Call for Symposium Proposals

 

Dear colleagues,                                                                                                                                                            

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