Dear all,

I am improving the cohesive zone model in 2-D proposed by Y.F. Gao to simulate delamination between sub-micron thick films in 3-D. However, I did not find the potential function proposed by Xu and Needleman in 3-D. If you know it please tell me

Hello every body,

As most of you know, fracture mechanics of polymer materials needs a special consideration of the viscoelastic material properties. Especially under thermomechanical loading the role of glass transition temperature T_g is very important. That is why people try to characterize the material with different methods including stress relaxation based on Time-Temperature superposition or DMA test.

a similar problem regarding the fracture mechanics of polymers appear when the material is under moisture loading. For example in Electronics Packaging the mold compound of the IC packages absorbs moisture and moisture decreases the interfacial strength between the Mold compound and leadframe.