I would invite you to present your research work at the Society of Experimental Mechanics Conference (visit www.sem.org  for more details). You are welcome to submit your abstract my two sessions: 

1. Mechanical Behavior of Nanocomposite Materials

2. Recent Advance in Composite Materials.

We are now accepting abstracts on: 

• Mechanics of hard and soft biological materials
• Mechanics of biomimetic materials and systems
• Experimental methods applied to biological materials and systems 

Dynamic Behavior of Materials Track at 2009 SEM Annual Conference & Exposition on Experimental and Applied Mechanics,

June 1-3, 2009 Albuquerque, NM

Abstract Deadline: October 16th, 2008

Sponsored by: The SEM Dynamic Behavior of Materials Technical Division

Organized by: Kathryn A. Dannemann (Chair), Southwest Research Institute;

                        Vijay Chalivendra (Vice Chair), University of Massachusetts, Dartmouth;

Hello,

The 53rd Congress of the Indian Society of Theoretical and Applied Mechanics (an International Meet) is slated to be held during last week of December 2008, in Hyderabad, India. The last date for sending in both the abstracts and the full-length papers is 30th September, 2008.

People from outside India are especially encouraged to participate. Hyderabad is well connected by flights. Usually, the ISTAM conferences are low on budget but high on enthusiasm. The ISTAM conferences typically cover a broad range of topics.

A symposium on Experimental Multi-Scale Mechanics is being organized for the 2008 SES conference at the University of Illinois at Urbana-Champaign from October 12th through October 15th. The conference website is located at http://ses2008.mechse.uiuc.edu/

To submit abstracts to this symposium please use the abstract submission form and select the symposium title. The deadline for abstract submissions is April 30, 2008.

The aim of the Experimental Multi-Scale Mechanics symposium is as follows:

Materialise introduces the Medical Innovations Conference 2008 in Vienna, Austria. Get inspired by the talents of Mozart, Strauss and Von Beethoven and join the experts to guide you through the infinite possibilities Materialise Medical can offer you in medical image processing and surgery planning.

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The US-China NSF Workshop and Summer Institute of
Bio- and Nano-Mechanics and Applications (UCWSI2007)
August 31 -- September 4, 2007
Beijing, China

I've been to two conferences this year and I've again seen the same annoying features in many talks that have been warned against by numerous people over the years.

Here are some tips that might come in handy :

The 2nd Nanostructures conference covers all aspects of Nanoscience and Nanotechnology dealing with materials synthesis, modeling and applications. Special topics include:

ITherm (http://www.ithermconference.org/) and ECTC (http://www.ectc.net/) are two important conferences in electronic packaging and systems. They are normally located at the same hotel and the same time. The attendees can register for both confercences by paying $100 extra. The total attendance of the two conferences is about 1500. The page counts of the proceedings of the two conferences together is more than 1600 every year. ITherm is more modeling and simulation focused. It is a very good opportunity for mechanicians to meet enigeers in semiconductor industry.

ITherm 2008

(cross-post to Biomch-L )

Two symposia solicit papers on biomechanics topics for the upcoming Materials Research Society meeting, November 26-30, 2007, Boston,  MA.  Short-form abstracts are due 20 June, 2007.

Symposium AA, Fundamentals of Nanoindentation and Nanotribology IV, solicits papers on the subject of nanomechanical characterization of  biological materials including biomolecules, cells and tissues.   Further details can be found here .

If you are interested by the computational aspects of fracture and failure of materials and structures,there is a dedicated conference for you : CFRAC 2007, which will be held in Nantes, France, 11-13 June 2007. It is an thematic conference of the European Community in Computational Methods in Applied Sciences (ECCOMAS). The for abstract is now closed. This conference wil involve a certian number

Advances in the research of the theory of Piezoelectricity and Acoustic Waves have provided essential foundation and new opportunities to device technology and have been fostering academic exchanges and interaction in the piezoelectric device industry.With the increased research activities in piezoelectricity and acoustic waves and recent fast growth in piezoelectric devices, we are also facing many technological challenges from real engineering applications and product design and manufacturing.Following the successful SPAWDA 2004 in Ningbo, Chinese Society of Theoretical and Applied Mechanics, IEEE UFFC and the Acoustical Society of China have decided, also with industrial support, to hold the SPAWDA 2006 at Zhejiang University, Hangzhou, Zhejiang, China from December 14-17.The conference topics include, but not limited to,

You are cordially invited to participate in the Symposium on the Mechanics of Electromagnetic Materials and Structures, the 5th International Conference on Nonlinear Mechanics (ICNM-V), to be held in Shanghai, China, June 11-14, 2007.  You may find more information at the website of the conference.

The symposium topics include piezoelectricity, ferroelectricity, magnetoelasticity, electromagnetic fluids and various applications in engineering and technology, but are not limited to the above. Experimental, theoretical, and computational studies are all welcome.

Please e-mail your one-page abstract(s) to any of us listed below. We look forward to hearing from you. If you have any questions, please do not hesitate to contact us at

Professor Ji Wang, Ningbo University, wangji@nbu.edu.cn

Professor Yuantai Hu, Central South University, hudeng@263.net

Professor Jiashi Yang, University of Nebraska, jyang1@unl.edu

Professor Daining Fang, Tsinghua University, fangdn@tsinghua.edu.cn

Submission of abstract: as soon as possible.

Notification of acceptance: Nov. 1, 2006

Submission of final paper(s) for the conference proceedings: Jan. 1, 2007