My name is Nanshu Lu. I am a second year doctoral student in the Suo group at Harvard Engineering and Applied Science.
I obtained my B.S. in Solid Mechanics from the Department of Engineering Mechanics at Tsinghua University, China. You can see my resume here.
My course background includes Strength of Materials, Continuum Mechanics and Fundamental Elasticity taken at Tsinghua University and graduate level Elastisity (ES 240) taught by Prof. J. Rice, Deformation of Solids (APY 293) taught by Prof. F. Spaepen, Fracture (ES 247) and Plasticity (ES 246) taught by Prof. J. Vlassak and Zhigang's another course Advanced Elasticity (ES 241) this semester here at Harvard.
My first teaching experience was TFing Zhigang's ES 240 last semester.
Although I think I've indulged in a systematic cognition of solid mechanics with somewhat solid understanding of this subject, I sometimes do lack a spirit of digesting materials and making them my own. It indeed has occured to me that having a hard time to fish out the proper solution to a novel problem although I've owned all the needed tools and skills. Under the instruction of John and Zhigang I hope I will make the transformation from a student learner to a scholar learner.
Nonlinear fracture mechanics joints main parts of solid mechanics: fracture, elasticity and plasticity, the essential foundation to my research interests of mechanics in thin films, both theories and experiments. One of my subject is about chip packaging interaction. It is well known that nowadays a typical electronic package assembly consists of different materials which are attached together in a variety of ways. No other course will be more proper for this subject than this "Fracture mechanics of thin films and composit materials". Though I've read literatures specialized on thin film debonding I believe taking this course is the most efficient way for me to have profound and comprehensive understanding of fracture mechanics as a whole.