biomaterials

Issue 2 of J. Mechanical Behavior of Biomedical Materials published

I am pleased to announce that Volume 1, Number 2 of the the recently-launched Journal of the Mechanical Behavior of Biomedical Materials (www.elsevier.com/locate/jmbbm) has been published by Elsevier. All JMBBM articles can be accessed free-of-charge on ScienceDirect until September 2008 (http://www.sciencedirect.com/science/journal/17516161).


Ying Li's picture

sandwich strcuture of dragonfly wing vein

sandwich strcuture of dragonfly wing vein

10% "early bird" discount off full registration fee for 2nd IC Mechanics of Biomaterials & Tissues - offer closes 26 October!

Elsevier is offering a 10% discount off the full registration fee for the 2nd International Conference on the Mechanics of Biomaterials & Tissues (www.icmobt.elsevier.com). This offer will end on 26 October 2007.

I hope you are able to come to Kaua'i and take part in this exciting and well-received conference.

Dean Eastbury

Publisher, Elsevier 


Elsevier launches new Journal of the Mechanical Behavior of Biomedical Materials

I am pleased to announce that Volume 1, Number 1 (January 2008) of the Journal of the Mechanical Behavior of Biomedical Materials is published in both print and online on ScienceDirect. This first issue contains three excellent review articles on bone and dentin, human enamel, and biocompatability of Ti-alloys as well as eight research papers.

The online version of all four issues in Volume 1 can be viewed free of charge until September 2008. For further details please see http://mail.elsevier-alerts.com/go.asp?/bESJ001/mQNA874/uOPDV5/xS5EBB

Dean Eastbury, Publisher

 


Richard Vinci's picture

Biomaterials faculty position at Lehigh University

I am chairing the search for a new faculty member in the Materials Science and Engineering Department at Lehigh. As you will see in the ad below, the position is in the Biomaterials area. I would like to encourage more applications from candidates with interests in biomechanics (so I will have good opportunities to collaborate), and would like to invite applicants from this forum. If you are not personally in a position to apply, please pass the announcement along to anyone you know who might be suitable. The closing date for applications is January 30, 2007.  See full description of the position.


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