lecture

These slides are used in a course on Plastic Deformation in Crystalline Solids.

On May 29th, Prof. Zhigang Suo, a member of the US National Academy of Engineering and professor of Mechanics and Materials at Harvard University, made two lectures for teachers and students in Tongji University, titled “from study in Harvard to be elected to the US National Academy of Engineering” and “Mechanics of Soft Active Materials”.

A very breif introduction to aspects of dynamic fracture mechanics.

An overview of several approaches to computational fracture mechanics for ductile structural metals.

In this lecture I'll describe a recent PhD Thesis by Zhen Zhang.

• Slides are attached.
• Reading material: Section 4 of Z. Suo, " Reliability of interconnect structures." pp. 265-324 in Volume 8: Interfacial and Nanoscale Failure (W.
  

Matrix cracking in composites and the competition between penetration and deflection when a crack approaches an interface, and the competition between advance in the interface and kinking out of the interface for an interface crack.

G. Bao and Z. Suo, " Remarks on crack-bridging concepts," Applied Mechanics Review. 45, 355-366 (1992).

Buckling delamination, with two slides on 1D vonKarman plates.

• Z. Suo and J. W. Hutchinson, "Interface crack between two elastic layers," Int. J. Fracture, 43, 1-18 (1990).
• Section III in J.W.
  

• Williams singularity
• Energy release rate
• Mode angle
• Stress oscillation
• Small scale contact
• Example 1:  A small crack on the interface
• Example 2:  Thin film debonding
• Interfacial fracture energy
• Four-point bend specimen
• Double-cantilever beam
• The use of the interfacial fracture energy
  

Dear Students of ES 242r / ENGM 940:

You may be interested in reading about the self-introductions of your fellow students. 

The attached notes are written mainly for myself. Most figures are missing. I'll draw these figures in class. So please take good notes in class.

Lecture 7.  Stability of large scale yielding crack growth & fracture mechanisms

• Various cracks in thin films under tensile or compressive stresses
• Micrographs of cracks in thin films
• A micrograph of a channel crack
• The origin of stress in a film
• Stress in a thin film due to mismatch in the coefficients of thermal expansion
• Stress in film due to bending
• Measure redisual stress using wafer curvature
• Channel crack:  initiation vs. steady propagation
• Steady-state energy release rate of a channel crack
• Channel crack in patterned structure

Lecture 5

Lecture 4

Lecture 3

fracture specimens and KIC

The slides for lecture 1 are attached.