The group of Mechanics &
Computation in the Mechanical Engineering department at Stanford University has
an opening for a postdoctoral position in the area of computational mechanics
as part of the new Army High-Performance Computing Research Center (AHPCRC),
under the direction of Adrian Lew. The appointment
is normally made for one year, with the possibility of renewal for a second
year. The ideal candidate would have a strong background on
computational solid mechanics and have programming experience, ideally in C++.
A good background in mathematics, especially numerical analysis, will be

This high-speed photography image recorded a very special fracture mechanics phenomenon: two fast cracks (as demonstrated by two shear shock waves) just met at the specimen center. After a steel projectile hit a model sandwich plate (steel/transparent Homalite -100 polymer/steel), stress wave propagation was observed in the form of photo-elasticity fringe movement. Two interfacial cracks from the two ends of the model sandwich plate, entered the field of view with very high speeds (> 1400m/s) and formed two shock waves (since the crack tip speed exceeded the shear wave speed of the polymer). For further technical details and more photos, click here to read the related paper (Xu and Rosakis, IJSS, 2002) For more real movies recorded from a high-speed camera( click here). It will take a few minutes to access my movie site since the size of each movie is quite large. But the movie resolution and layout from my site is much better than the movie from YouTube (below). © Dr. L. R. Xu (Vanderbilt University) and Dr. A. J. Rosakis (California Institute of Technology)

This high-speed photography image shows a mode I crack (representing by a symmetric photo elasticity fringe pattern) is approaching a weak interface in a brittle polymer (Homatel-100). The crack tip speed is around 300-400 m/s. There will be three possibly situations for dynamic interfacial failure mode transitions : 1) crack kinks at the interface, 2) crack directly penetrates the interface and 3) interface debonding occurs before the incident crack reaches the interface. Which case will occur?