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Li Han's picture

Water diffusion and fracture behavior in nano-porous low-k dielectric film stacks

Among various low-dielectric constant low-k materials under development, organosilicate glassesOSGs containing nanometer-size pores are leading candidates for use as intrametal dielectrics infuture microelectronics technologies. In this paper, we investigate the direct impact of waterdiffusion on the fracture behavior of film stacks that contain porous OSG coatings.

State-of-the-art understanding of cracking for porous materials?

It seems there are quite a few experimental studies [1,2] on the fracture properties of porous materials, like nanoporous low-k dielectrics, as a function of porosity. Can anyone point out some references on the theoretical part, like the available models, computational methods or analytical approaches that can capture microstructure information, including porosity, pore geometry etc. Interface delamination of porous materials is also of interest. Thanks.

MichelleLOyen's picture

North American Workshop on Applications of the Physics of Porous Media

The 7th North American Workshop on Applications of the Physics of Porous Media will be held in Puerto Vallarta, Mexico, November 2-6, 2007. This will be the 7th biennial meeting of researchers around the world who are interested in the phenomena associated with physics of fluid flow and deformation in porous media and its applications to a broad range of basic roblems encountered in geophysics, geomechanics, medical physics, and condensed matter physics.

Full details are available at the website:

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