Siva P V Nadimpalli's blog

Dear Colleagues,

We invite you to submit an abstract to the symposium titled “Mechanics of Deformation and Failure of Energy Materials” at the IMECE 2015, Houston, Texas, November 13-19, 2015. 

More details about the symposium and the abstract submission can be found in the attachment and at the Congress 2015 website http://www.asmeconferences.org/Congress2015/. Abstracts are due on March 2, 2015 and please select Track 12 -37 while submitting the abstract.

Dear Colleagues,

Please consider attending the symposium titled “mechanics and
electrochemistry of energy storage materials” at the SES 51^st Annual
Technical Meeting, Oct 1-3, 2014, Purdue University, West lefayette, IN 47907.

There is an opening for a
PhD student position in Dr. Nadimpalli’s group at the New Jersey Institute of
Technology starting from Fall2014. Candidate with good academic credentials and an interest to work in experimental research projects are encouraged to apply.
Ideal candidate should have a master’s degree in mechanical/materials
science/aerospace or related field with a good background in Solid Mechanics,
Materials Science, and Experimental Methods (including but not limited to SEM,
TEM, and nanofabrication methods).

Hi All,

I have a question in my mind, we all know that the fracture toughness of isotropic, homogeneous materials is dependent on state of stress (plane strain and plane stress). It is higher in case of plane stress and decreases as the constraint increases and attains a constant value which we call "plane strain fracture toughness". But, what about the fracture toughness in interfaces? or fracture of thin layer bonded between two substrates (adhesive type)? I am sure that it will be a function of this as well.