iMechanica - Comments for "Symposium on Mechanics of Integrated Structures and Materials in Advanced Technology"
https://imechanica.org/node/521
Comments for "Symposium on Mechanics of Integrated Structures and Materials in Advanced Technology"enThis looks like a great symposium on integrated structures
https://imechanica.org/comment/2842#comment-2842
<a id="comment-2842"></a>
<p><em>In reply to <a href="https://imechanica.org/node/521">Symposium on Mechanics of Integrated Structures and Materials in Advanced Technology</a></em></p>
<div class="field field-name-comment-body field-type-text-long field-label-hidden"><div class="field-items"><div class="field-item even"><p>Rui: This is very well organized and I'm looking forward to the symposium. Thank you and your co-organizers for getting people together.</p>
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</ul>Mon, 14 May 2007 19:39:46 +0000Zhigang Suocomment 2842 at https://imechanica.orgIntegrated Structures Symposium at McMat 2007
https://imechanica.org/comment/2776#comment-2776
<a id="comment-2776"></a>
<p><em>In reply to <a href="https://imechanica.org/node/521">Symposium on Mechanics of Integrated Structures and Materials in Advanced Technology</a></em></p>
<div class="field field-name-comment-body field-type-text-long field-label-hidden"><div class="field-items"><div class="field-item even"><p>
The technical program of this symposium is now finalized as follows.
</p>
<p class="MsoNormal">
<strong>Session 16-2-1: Cu/low k interconnects I (Monday, June 04, <span class="fnt8sg">09:45-11:45 AM)</span></strong>
</p>
<p class="MsoNormal">
<span>Session Chairs: <a href="http://www.imechanica.org/user/133" target="_blank">Jun He</a> and <a href="http://imechanica.org/user/22" target="_blank">Rui Huang</a> </span>
</p>
<ul><li><strong>Carl Thompson</strong> (MIT), Void Dynamics During Electromigration in Cu Interconnects (<strong><span>keynote</span></strong>)</li>
<li><strong>Martin Gall</strong> (Freescale), Electromigration Early Failure Detection in Dual-Inlaid Cu Interconnects</li>
<li><a href="http://imechanica.org/user/446"><strong>Lijuan Zhang</strong></a> (UT Austin), Electromigration Reliability of 60 nm Dual Damascene Cu Interconnects</li>
<li><a href="http://www.imechanica.org/user/133" target="_blank"><strong>Jun He</strong></a> (Intel), Interconnect scaling, electromigartion lifetime, and critical void volume</li>
</ul><p class="MsoNormal">
</p>
<p class="MsoNormal">
<strong>Session 16-2-2: Cu/low k interconnects II (Monday, June 04, <span class="fnt8sg">1:15-3:15 PM)</span></strong>
</p>
<p class="MsoNormal">
<span>Session Chairs: <a href="http://www.imechanica.org/user/133" target="_blank">Jun He</a> and <a href="http://imechanica.org/user/22" target="_blank">Rui Huang</a> </span>
</p>
<ul><li><strong><span>David Read</span></strong><span> (NIST), AC Fatigue Tests of Damascene Interconnect Structures (<strong><span>keynote</span></strong>)</span></li>
<li><strong><span>Jin An </span></strong><span>(UT Austin), The Influence of grain orientation on local stresses in 180 nm Cu Interconnects</span></li>
<li><a href="http://imechanica.org/user/145"><strong><span>Youbo Lin</span></strong></a> <span> (Harvard), Structure, mechanical properties and fracture of organosilicate glass thin films</span></li>
<li><a href="http://www.imechanica.org/user/2"><strong><span>Zhigang Suo</span></strong></a> <span> (Harvard), Effect of coating on the reliability of stiff island on compliant substrate</span></li>
</ul><p>
</p>
<p>
<strong><span>Session 16-2-3: Chip-package interactions (Monday, June 4, 3:30-5:30 PM)</span></strong>
</p>
<p>
<span>Session Chairs: <a href="http://imechanica.org/user/22" target="_blank">Rui Huang</a> and </span>Ibrahim Bekâr
</p>
<ul><li><a href="http://www.imechanica.org/user/224"><strong><span>Paul Ho</span></strong></a> <span> (UT Austin), Impact of Chip-Packaging Interaction on Interfacial Cracking of Multilevel Cu/Low-k Interconnect Structures (<strong><span>keynote</span></strong>)</span></li>
<li><a href="http://imechanica.org/user/124"><strong><span>Jie-Hua (Jeff) Zhao</span></strong></a> <span> (TI), </span><span>Packaging optimization to mitigate stress induced parameter shift in precision devices</span></li>
<li><a href="http://imechanica.org/user/22"><strong><span>Rui Huang</span></strong></a> <span> (UT Austin), Influence of Interfacial Delamination on Channel Cracking of Brittle Thin Films</span></li>
<li><a href="http://www.imechanica.org/user/495"><strong><span>Zhenyu Zhang</span></strong></a> <strong><span> </span></strong><span>(ORNL), Quantum Stability of Ultrathin Metal Overlayer on Semiconductor Substrates</span></li>
</ul><p>
</p>
<p>
<strong><span>Session 16-2-7: </span></strong><strong><span>Metrology for integrated small structures</span></strong><strong><span> (Tuesday, June 5, 9:45-11:45 AM)</span></strong>
</p>
<p>
<span>Session Chairs: <a href="http://imechanica.org/user/22" target="_blank">Rui Huang</a> </span>
</p>
<ul><li><a href="http://imechanica.org/user/828"><strong><span>Chris Stafford</span></strong></a> <span> (NIST), Surface Wrinkling as a Metrology Tool (<strong><span>keynote</span></strong>)</span></li>
<li><strong><span><a href="http://imechanica.org/user/15">Xi Chen</a> </span></strong><span>(Columbia Univ), Measuring elastoplastic properties of thin films by using nanoindentation</span></li>
<li><a href="http://imechanica.org/user/1056"><strong><span>Bin Li</span></strong></a> <span> (UT Austin), </span><span>Fabrication and Mechanical Characterization of Silicon Nanolines</span></li>
<li><strong>Kristen Mills</strong> (Univ. Michigan), Nano-cracking of plasma-oxidized polydimethylsiloxane and some of its applications in nano/biotechnology</li>
</ul><p>
</p>
<p>
<strong><span>Session 16-2-5: </span></strong><strong><span>Mechanics and materials of macroelectrinics</span></strong><strong><span> (Tuesday, June 5, 1:15-3:15 PM)</span></strong>
</p>
<p>
<span>Session Chairs: <a href="http://www.imechanica.org/user/10">Teng Li</a> </span>
</p>
<ul><li><strong><span>Ananth Dodabalapur</span></strong><strong><span> </span></strong><span>(UT Austin), Organic and Polymer Transistors for Flexible Electronics <span> </span>(<strong><span>keynote</span></strong>)</span></li>
<li><strong><span>Darran Cairns</span></strong><strong><span> </span></strong><span>(West Virginia Univ), Mechanical Studies of Indium Tin Oxide Coated Polymer Films for Flexible Displays</span></li>
<li><a href="http://www.imechanica.org/user/10"><strong><span>Teng Li </span></strong></a> <span>(Univ. Maryland), Suitably Patterned Thin Films of Stiff Materials As General Platforms For Flexible Electronics</span></li>
<li><a href="http://www.imechanica.org/user/183"><strong><span>Hanqing Jiang</span></strong></a> <span> (Arizona State Univ), Mechanics of Stretchable electronics</span></li>
</ul><p>
</p>
<p>
<strong><span>Session 16-2-6: </span></strong><strong><span>Mechanics </span></strong><strong><span>of integrated MEMS/NEMS</span></strong><strong><span> (Tuesday, June 5, 3:30-5:30 PM)</span></strong>
</p>
<p>
<span>Session Chairs: Jun Lou</span>
</p>
<ul><li><strong><span>David Clarke</span></strong><span> (UC Santa Barbara), </span><span>The Concurrent Effects of Adhesion, Creep and Roughness on the Propensity for Stiction of Small Scale Mechanical Contacts</span><span> (<strong><span>keynote</span></strong>)</span></li>
<li><strong><span>John X.J. Zhang</span></strong><strong><span> </span></strong><span>(UT Austin), Nano Opto-electro-mechanical Characterization of Neuron Membrane Mechanics<br />
Under Growth and Differentiation</span></li>
<li><strong><span>Thomas Buchheit</span></strong><span> (Sandia), Characterizing the Failure Strength and Fatigue Reliability of a Bulk Silicon Micromachining Process</span></li>
<li><strong><span>Jun Lou</span></strong><span> (Rice Univ.), Nanomechanical Testing Using NEMS Devices Based on Suspended Nanotubes/Nanowires</span></li>
</ul><p></p>
<p>
<strong><span>Session 16-2-4: </span></strong><strong><span>Front-end strain engineering</span></strong><strong><span> (Wednesday, June 6, 9:45-11:45 AM)</span></strong>
</p>
<p>
<span>Session Chairs: </span>Dureseti Chidambarrao
</p>
<ul><li><strong><span>Sanjay Banerjee</span></strong><span> (UT Austin), Strain and Bandgap Engineered High Channel Mobility MOSFETs (<strong><span>keynote</span></strong>)</span></li>
<li><strong><span>Klaus Schwarz</span></strong><span> (IBM), </span><span>Defect Modeling in the Context of Strain Engineering</span></li>
<li><strong><span>Anthony Domenicucci</span></strong><strong><span> </span></strong><span>(IBM)</span><strong><span>, </span></strong><span>Measuring Channel Strain in MOSFET Devices Using TEM Techniques</span></li>
<li><strong><span>Jagannathan Rajagopalan</span></strong><span> (Univ. </span><span>Illinois</span><span>), </span><span>Thermally Activated Plastic Strain Recovery in Freestanding Nanocrystalline Aluminum Thin Films</span>
</li>
</ul><p>
</p>
<p>
<strong><span>Session 16-2-8: </span></strong><strong><span><span>Defects and reliability of integrated devices</span></span></strong><strong><span> (Wednesday, June 6, 1:15-3:15 PM)</span></strong>
</p>
<p>
<span>Session Chairs: <a href="http://www.imechanica.org/user/166">Xiao-Yan Gong</a> and <a href="http://imechanica.org/user/22" target="_blank">Rui Huang</a> </span>
</p>
<ul><li><a href="http://www.imechanica.org/user/2"><strong><span>Zhigang Suo</span></strong></a> <span> (Harvard), A method to analyze dislocation injection from sharp features</span></li>
<li><a href="http://imechanica.org/user/842"><strong><span>Gang Feng</span></strong></a> <span><a href="http://imechanica.org/user/842"> (</a> Brown Univ.), Modeling Interfacial Misfit Dislocations In A Heteroepitaxial Island</span></li>
<li><strong><span><a href="http://www.imechanica.org/user/166">Xiao-Yan Gong</a> </span></strong><span>(Medical Implant Mechanics LLC), Reliability of Nitinol Stents</span></li>
<li><a href="http://imechanica.org/user/597"><strong><span>Bo Yang</span></strong></a> <span> (Florida Inst. Of Tech.),</span><span> </span><span>Interactive Growth of Delamination and Channel Cracks in Thin Films</span></li>
<li><strong><span>Zhen Liu</span></strong><span> (CCNY), Thin film surface evolution and stress relaxation due to coupled surface and grain boundary diffusion</span></li>
</ul><p>
<strong><span>Session 16-2-9: </span></strong><strong><span>Self-assembled materials and structures I</span></strong><strong><span> (Wednesday, June 6, 3:30-5:30 PM)</span></strong>
</p>
<p>
<span>Session Chairs: <a href="http://imechanica.org/user/22">Rui Huang</a> and <a href="http://www.imechanica.org/user/49">Wei Lu</a> </span>
</p>
<ul><li><strong><span>Martin Dunn</span></strong><span> (Univ. Colorado), A Computational Design Methodology for Self-Assembled Micro and Nanostructures</span></li>
<li><a href="http://imechanica.org/user/27"><strong><span>Wei Hong</span></strong></a> <span> (Harvard Univ.), Step dynamics on a silicon surface due to the combined action of strain and electric current</span></li>
<li><a href="http://imechanica.org/user/1032"><strong><span>Robert Kukta</span></strong></a> <span> (SUNY-SB), Self-assembly of Nanostructures on Topographically Pattern Substrates</span></li>
<li><strong><span>Long-Qing Chen</span></strong><span> (Penn State Univ), Phase transitions, domain structures and switching in nanoferroelectrics</span></li>
<li><strong>Nickolay Shestopalov</strong> (UT Austin), Controlled self-assembly: Basic principles and simulations</li>
</ul><p></p>
<p>
<strong><span>Session 16-2-10: </span></strong><strong><span>Self-assembled materials and structures II</span></strong><strong><span> (Thursday, June 7, 8:30-10:30 AM)</span></strong>
</p>
<p>
<span>Session Chairs: <a href="http://www.imechanica.org/user/49">Wei Lu</a> </span>
</p>
<ul><li><strong><span>Ishwar K. Puri</span></strong><strong><span> </span></strong><span>(Virginia Tech<span>), </span>Attributes of self assembly at different length scales: from nano to micro<span> (<strong><span>keynote</span></strong>)</span></span></li>
<li><span><a href="http://imechanica.org/user/70" target="_blank" title="Pradeep"><strong><span>Pradeep Sharma</span></strong></a> (Univ. of Houston), Engineering Perfect Long Range Order in Self-assembling Nanostructures</span></li>
<li> <a href="http://imechanica.org/user/26"><strong><span>Yaoyu Pang</span></strong></a> <span> (UT Austin), </span><span>Effect of elastic anisotropy on self-assembly of surface patterns in epitaxial thin films</span></li>
<li><strong><span>Cheng-Hsin Chiu</span></strong><span> (Singapore), </span><span>The Formation of Nanostructures on the Stranski-Krastanow Systems by Surface Undulation</span></li>
</ul><p></p>
<p>
<strong><span>Session 16-2-11: </span></strong><strong><span>Self-assembled materials and structures III</span></strong><strong><span> (Thursday, June 7, 10:45 AM -12:45 PM)</span></strong>
</p>
<p>
<span>Session Chairs: <a href="http://www.imechanica.org/user/49">Wei Lu</a> and <a href="http://imechanica.org/user/22">Rui Huang</a> </span>
</p>
<ul><li><strong><span>Vivek Shenoy</span></strong><span> (Brown Univ.), Metastability in 2D Self-Assembling Systems (<strong><span>keynote</span></strong>)</span>
</li>
<li><a href="http://imechanica.org/user/1177"><strong><span>Yong-Wei Zhang</span></strong></a> <span> (Singapore), Modeling the Growth of Ordered Heteroepitaxial Quantum Dots and Quantum Rings Using Guided Self-Assembly</span></li>
<li><a href="http://www.imechanica.org/user/49"><strong><span>Wei Lu</span></strong></a> <span><a href="http://www.imechanica.org/user/49"> </a> (Univ. </span><span>Michigan</span><span>), </span><span>Self-assembly of metallic quantum dots on a semiconductor substrate</span></li>
<li><strong><span>Gemunu Gunaratne</span></strong><span> (Univ. Houston), Nanoscale Self-Assembly: A Theoretical Analysis</span></li>
</ul><p></p>
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</ul>Thu, 10 May 2007 21:59:45 +0000Rui Huangcomment 2776 at https://imechanica.orgList of speakers
https://imechanica.org/comment/491#comment-491
<a id="comment-491"></a>
<p><em>In reply to <a href="https://imechanica.org/node/521">Symposium on Mechanics of Integrated Structures and Materials in Advanced Technology</a></em></p>
<div class="field field-name-comment-body field-type-text-long field-label-hidden"><div class="field-items"><div class="field-item even"><p>Here is an evolving list of speakers who have agreed to present their works at this symposium. I will update this list as we receive more abstracts or informal commitments. </p>
<ul><li><a href="http://www.imechanica.org/user/2" target="_blank" title="Suo" class="links"><strong>Zhigang Suo</strong></a>, Harvard University</li>
<li><strong>Carl V. Thompson</strong>, MIT</li>
<li><strong>David Clarke</strong>, University of California at Santa Barbara</li>
<li><a href="http://www.imechanica.org/user/224" target="_blank" title="Ho" class="links"><strong>Paul Ho</strong></a>, University of Texas at Austin (Interconnects and Packaging)</li>
<li><strong>Martin Gall</strong>, Freescale</li>
<li><strong>Jeff Zhao</strong>, Texas Instruments</li>
<li><strong>Dureseti Chidambarrao</strong>, IBM (CMOS strain engineering)</li>
<li><span><strong>Klaus Schwarz</strong>, IBM (defect strain engineering)<br /></span></li>
<li><a href="http://www.imechanica.org/user/143" target="_blank" title="Min" class="links"><strong>Min Huang</strong></a>, Texas Instruments </li>
<li><strong>Sanjay Banerjee</strong>, University of Texas at Austin (Director of Microelectronics Research Center)</li>
<li><strong>John X.J. Zhang</strong>, University of Texas at Austin (MEMS/BioMEMS)</li>
<li><strong>Long-Qing Chen</strong>, Penn State University (ferroelectric thin films)</li>
<li><strong>David Read</strong>, NIST (metrology)</li>
<li><strong>Chris Stafford</strong>, NIST (soft materials metrology)</li>
<li><a href="/user/15" target="_blank" title="Xi Chen" class="links">Xi Chen,</a> Columbia University (nanoindentation)</li>
<li><a href="http://www.imechanica.org/user/166" target="_blank" title="Gong" class="links"><strong>Xiao-yan Gong</strong></a>, Medical Implant Mechanics LLC (medical implants)</li>
<li><a href="http://www.imechanica.org/user/495" target="_blank" title="Zhang" class="links"><strong>Zhenyu Zhang</strong></a>, Oak Ridge National Lab</li>
<li><a href="/user/655" target="_blank" title="Saif" class="links"><strong>Taher Saif</strong></a>, University of Illinois</li>
<li><a href="http://www.imechanica.org/user/10" target="_blank" title="Teng" class="links"><strong>Teng Li</strong>, </a>University of Maryland (flexible electronics)</li>
<li><strong>Darran Cairns</strong>, West Virginia Univ. (macroelectronics)</li>
<li><strong>Ananth Dodabalapur</strong>, University of Texas at Austin (organic electronics) </li>
<li><a href="http://www.imechanica.org/user/183" target="_blank" title="Jiang" class="links"><strong>Hanqing Jiang</strong></a>, Arizona State Univerity (flexible electronics)</li>
<li><strong>Jun Lou</strong>, Rice University</li>
<li><strong>Thomas Buchheit</strong>, Sandia National Lab (MEMS/NEMS)</li>
<li><strong><a href="http://www.imechanica.org/user/49" target="_blank" title="Wei Lu" class="links">Wei Lu</a>, </strong>University of Michigan (self assembly)</li>
<li><strong>Ishwar K. Puri</strong>, Virginia Tech (self assembly)</li>
<li><strong>Vivek Shenoy</strong>, Brown University</li>
<li><a href="/user/70" target="_blank" title="Pradeep" class="links"><strong>Pradeep Sharma</strong></a>, University of Houston</li>
<li><strong>Gemunu Gunaratne</strong>, University of Houston </li>
<li><a href="/user/27" target="_blank" title="Wei Hong" class="links">Wei Hong</a>, Harvard Univeristy</li>
<li><strong>Yong-Wei Zhang</strong>, National University of Singapore</li>
<li><strong>Cheng-Hsin Chiu</strong>, National University of Singapore</li>
<li><a href="http://www.imechanica.org/user/133" target="_blank" title="Jun He" class="links"><strong>Jun He</strong></a>, Intel</li>
<li><strong>Rui Huang</strong>, University of Texas at Austin</li>
</ul><p>RH</p>
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</ul>Mon, 11 Dec 2006 18:31:07 +0000Rui Huangcomment 491 at https://imechanica.orgError | iMechanica