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Revision of [ASME IMECE 2018] Symposium on 3D Printed Soft Materials from Mon, 2018-07-02 09:30

Howon Lee's picture

Dear Colleagues, We would like to invite you to submit an abstract to the symposium on 3D Printed Soft Materials at the ASME 2018 IMECE to be held from November 9 to November 15, 2018 in Pittsburgh, PA. 

Additive manufacturing, also known as 3D printing, offers unique opportunities to explore novel properties and mechanics of soft materials. This topic calls for abstracts from research efforts related to soft materials with novel properties realized or created using 3D printing techniques. With the growing interest in soft materials and various emerging 3D printing techniques, our symposium on 3D Printed Soft Materials in the past few years have been very well attended by scientists and engineers from diverse research areas. We are very delighted that these exciting sessions will continue and possibly grow further this year, and we hope that you will consider our symposium for presenting your recent research.

Specific topics of interest include, but are not limited to:

- Mechanics of 3D printed materials, such as their constitutive behaviors and failure behaviors
- Novel printing technologies for soft materials
- Printable materials with improved or new functionalities
- Printed soft active materials or composites that respond to various stimuli (i.e. the 4D printing)
- Printed soft metamaterials with novel properties, such as acoustic properties, negative Poisson’s ratio, etc.
- Design theory or methodology for soft materials that will be realized through 3D printing

- Applications of 3D printed soft materials or composites 

This year, we will have keynote presentations from the two distinguished speakers below. - Professor H. Jerry Qi (Georgia Institute of Technology)- Dr. Christopher Spadaccini (Lawrence Livermore National Laboratory)


Abstract submission is now open. ( Please submit your recent work to our topic, "12-2 3D Printed Soft Materials”. Please note that we accept “presentation only” abstracts.

Deadline for submission is July 23rd, 2018.  Should you have any questions, please feel free to contact us.   Best regards,Howon Lee, on behalf of Topic Organizers Topic OrganizersHowon Lee, Assistant Professor, Rutgers University - New Brunswick, NJSung Hoon Kang, Assistant Professor, Johns Hopkins University, Baltimore, MDKai Yu, Assistant Professor, University of Colorado - Denver, COQiming Wang, Assistant Professor, University of Southern California, CA

PDF icon 3D Printed Soft Materials_2018.pdf76.25 KB
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