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Symposium on Mechanics of Integrated Materials and Structures in Advanced Technologies, at 2008 ASME Congress

Rui Huang's picture

As part of the 2008 ASME International Mechanical Engineering Congress and Exposition (IMECE), this symposium is being organized by Technical Committee of Integrated Structures (TCIS) of the ASME Applied Mechanics Division (AMD).

When and Where: October 31 - November 6, 2008, Boston, Massachusetts.

Abstract submission deadline: March 3, 2008 

To submit your abstracts to this symposium, select Track 12 (Mechanics of Solids, Structures and Fluids) and Topic 12-2.

 

Description:

This symposium will provide a forum for the discussions of the latest advances in the cross-disciplinary field of integrated structures, including advanced interconnects for integrated circuits, micro/nano electromechanical systems, and biomedical devices. The objective is to forge interactions among active researchers from both academia and industries working in the areas of applied mechanics, materials science/engineering, and advanced technologies. Both fundamental research in mechanics and materials and practical applications in advanced technologies are welcome.

Topics and organizers:

  • Mechanics of materials in microelectronics (Xiaohu Liu , IBM; Jun He , Intel)
  • Mechanics of flexible electronics (Teng Li , University of Maryland)
  • Mechanical measurements in integrated small structures (Jun He , Intel)
  • Mechanics of molecular and biological structures (Xi Chen , Columbia University)
  • Mechanics of metamaterials for acoustic and optic applications (Martin Dunn , University of Colorado at Boulder)
  • Mechanics of multifunctional and smart materials (Chad Landis , University of Texas at Austin)
  • Mechanics and materials in energy systems (Xiaodong Li , University of South Carolina)
  • Nanofabricaition and self assembly (Wei Lu , University of Michigan)

 

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