SES 2023:Symposium 10-11:Recent Advances in Modeling Materials across Nano- and Micro-scales

We cordially invite you to present your work at our symposium titled "Recent Advances in Modeling and Simulation at Nano- and Micro-scales", as part of the 2023 Society of Engineering Science Annual Meeting (SES 2023). The meeting will be held on October 8-11, 2023 in Minneapolis, MN. The symposium is listed as Symposium 10-11 under the Mechanics of Solids and Structures thematic area on the submission website. To submit an abstract, please visit: https://attendesource.com/profile/form/index.cfm?PKformID=0x127567f5cd

The deadline for abstract submission is May 5, 2023. Further details on the conference and abstract submission can be found at the conference website: https://2023ses.com/

Please feel free to contact us for any questions or concerns. A description of the scope of our symposium is as follows:

Recent Advances in Modeling Materials across Nano- and Micro-scales

Nano and micromechanics have attracted researchers’ attention due to their critical role in determining the macroscopic behavior of materials. This symposium seeks to bring together researchers working on novel areas of modeling and simulation of materials at the nano- and micro-scales. The contributions welcomed in this symposium focus on modeling and simulation of nano- and micro-mechanics of materials, including but not limited to atomistic simulations (such as those performed with atomistic potentials, molecular dynamics), electronic structure calculations (such as density functional theory), micro-mechanics models (such as phase field, dislocation dynamics, crystal plasticity), statistical mechanics, and the combination of these models with novel approaches such as multiscale and multiphysics modeling, data-driven and machine learning approaches. Research results on the fundamental understanding of response of materials to magnetic or electric fields, temperature and light, deformation mechanisms in materials, actuation of materials, novel computational approaches, numerical implementations aspects, and application of established computational frameworks are welcome. Applications of such methods to a wide range of materials are also welcome, including crystalline (metals and alloys), amorphous (glassy), and soft materials (such as polymers and liquid crystal elastomers). 

We look forward to seeing you at SES 2023!

Sincerely,
Swarnava Ghosh, Oak Ridge National Laboratory
Mauricio Ponga, The University of British Columbia
Juan Pedro Mendez Granado, Sandia National Laboratory
Nikhil Chandra Admal, University of Illinois Urbana Champaign
Vikram Gavini, University of Michigan