Ph.D. position avaliable at the University of Waterloo. This program is funded by NSERC and CFI to construct UHV variable temperature nanoindenter and micro-tensile tester. Candiates must have a strong background in instrumentations and programming. Please contact Ting Tsui at tttsui [at] uwaterloo.ca (tttsui[at]uwaterloo[dot]ca)
This is a fully funded research project at the University of Waterloo, Canada. The objective is to construct a PECVD and a UV cure chambers for porous dielectric thin film depositions. In addition to building chambers, the candidate will conduct experiments in thin film fracture and small scale deformation. Please email your CV to tttsui [at] uwaterloo.ca
One of the most common forms of cohesive failure observed in brittle thin film subjected to a tensile residual stress is channel cracking, a fracture mode in which through-film cracks propagate in the film. The crack growth rate depends on intrinsic film properties, residual stress, the presence of reactive species in the environments, and the precise film stack. In this paper, we investigate the effect of various buffer layers sandwiched between a brittle carbon-doped-silicate (CDS) film and a silicon substrate on channel cracking of the CDS film.
