EMI 2018 Mini-Symposium MS20 “Nonlinear mechanics of highly deformable solids and structures”

Dear Colleague,

The next Engineering Mechanics Institute Conference (EMI) will take place from May 29th to June 1st, 2018, at MIT.

As organizers of the Mini-Symposium MS20 “Nonlinear mechanics of highly deformable solids and structures”, it is our pleasure to invite you and your students to participate in our mini symposium.
The deadline for abstract submission is January 31st, 2018.

A link to the conference website and abstract submission portal is: https://umi.mit.edu/EMI2018

We are looking forward to your contribution and to seeing you at the meeting.

MS Description:

Advancements in design and application of materials and structures that can perform at large deformations, together with the increasing interest in deformation of biological materials, are continually revealing new mechanical phenomena that are beyond explanation by classical theories. This has led to a renewed interest in failure mechanisms that appear at large strains such as fracture, cavitation and delamination, and the identification of reversible instability patterns such as fingering, fringing, creasing and elastic necking, that can possibly be exploited for future engineering applications. The objective of this symposium is to provide a forum for researchers from academia, industry and national labs to present, discuss and exchange the latest development in theoretical, computational, and experimental studies on nonlinear solid mechanics across a wide range of length-scales. Both fundamental research and practical applications are welcome. Topics invited for this symposium include but are not limited to:

    Failure – fracture and cavitation
    Rate-dependent material response
    Material characterization
    Instabilities in solids and structures
    Interface phenomena – adhesion and peeling
    Biological materials and bio inspired systems
    Mechanics of 3D printed materials and structures
    Wave propagation phenomena

Best regards,
 
Teng Zhang, Syracuse University
Stephan Rudykh, Technion
Qiming Wang, University of Southern California
Tal Cohen, MIT