Dear Esteemed Researcher,

It is our pleasure to invite you to attend and submit an abstract to our symposium on “Plasticity and Damage Size Effects at the Micron and Nano Length Scales'' to be held at The 45th Annual Technical Meeting of the Society of Engineering Science; October 12–15, 2008 at the University of Illinois at Urbana-Champaign. If you are interested, abstracts can be submitted at: http://ses2008.mechse.uiuc.edu/content/call_for_abstracts/.

The deadline for submission of abstracts is June 2nd, 2008.

Symposium Organizers

Rashid K. Abu Al-Rub, rabualrub@civil.tamu.edu

Texas A&M University

George Z. Voyiadjis, voyiadjis@eng.lsu.edu

Louisiana State University

Cemal Basaran,  cjb@eng.buffalo.edu

The State University of New York at Buffalo