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Lecture 6 Channel cracks in thin films
Mon, 2007-02-19 15:50 - Zhigang Suo
- Various cracks in thin films under tensile or compressive stresses
- Micrographs of cracks in thin films
- A micrograph of a channel crack
- The origin of stress in a film
- Stress in a thin film due to mismatch in the coefficients of thermal expansion
- Stress in film due to bending
- Measure redisual stress using wafer curvature
- Channel crack: initiation vs. steady propagation
- Steady-state energy release rate of a channel crack
- Channel crack in patterned structure
- Fracture mechanics as a division of labor
- Small structures: a new economy
- Moisture-assisted crack growth
- A method to measure G. G-meter
- Measure crack driving force due to residual stress field
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Lecture 6 channel cracks.pdf | 877.19 KB |
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