FEA engineer job position in Microsoft, Mountain View, CA

Finite Element Analysis (FEA) and test data
analysis Engineer Job Description:

Microsoft
is a world leader in the design of entertainment devices. We are looking for a
creative, talented and experienced Finite Element Analysis (FEA) and test data
analysis Engineer.

In this
position, you will be responsible for performing FEA and parametric analysis on
components, subsystems and system. This includes Xbox
Console/Kinect system and/or testing and analysis to isolate the
failures and performing physical failure analysis to locate the defect.

The Finite
Element Analysis Engineer will be in key leadership and very visible positions
interfacing with Product Development and with Quality, Manufacturing and
Procurement acting as the primary owner and driver of ensuring reliable designs
that meets or exceed customers’ expectations through innovative FEA
predictions.

The
candidate’s primary responsibility will be
development and implementation of methodologies/techniques, (esp. FEA but not
limited to ) to enhance product reliability. The candidate will be required to
analyze and verify engineering design concepts of electro and opto-mechanical
products using Failure analysis techniques, simulation and test tools. He/she
will be expected to propose design improvement based on analyses results.

The
individual should be able to use knowledge of product design and manufacturing
to develop Failure Modes and Effects Analysis (FMEA). Knowledge of statistical
techniques and models is required to analyze test data and estimate product
life cycle performance.

The
successful candidate should be considered as an expert in his or her technical
field as well as having a proven track record of success . The candidate must
demonstrate a detailed understanding of the significance of time to market,
risk mitigation, contingency plans, return on investment, etc.

Qualifications:

1.      Strong background in solid
mechanics and material science, and experience in contact mechanics, fracture
mechanics and/or computational fluid mechanics is preferred.

2.     
Have knowledge of
electronics packaging related area and have experience on modeling of solder
fatigue, structural modal analysis, vibration, and shock/drop analysis. Thermal
fluid simulation experience is a plus.

3.      Expert at numerical
methods, including theory and hands on experience on FEA software, e.g. ANSYS,
ABAQUS, Hypermesh, etc.

 If you are interested or want to know more,
please feel free to contact me directly. My
email address is zhenzh@microsoft.com.