In this paper, we report comprehensive experimental and theoretical
studies of bending in structures relevant to inorganic flexible electronics.
Different from previous mechanics models of related systems, our analysis does not
assume the thin film to cover the entire substrate, thereby explicitly
accounting for effects of edges and finite device sizes, both of which play
critically important roles in the mechanics and bending properties. These
thin-film islands give nonuniform stress, with maxima that often appear at the
edges and spatially non-uniform shear and normal stresses along the film/substrate
interface. Although these results are generally applicable to all classes of

Prof.D.N. Fang and his collaborators (Prof. Y.P. Wan, Prof. X. Feng and Prof. A.K. Soh) work on the functional materials, such as ferroelectric and ferromagnetic materials. Recently, he published a review article which presents an overview of recent progress on magnetomechanical deformation and fracture of ferromagnetic materials. Following a brief introduction of the classical magnetoelasticity and the magnetomechanical behavior of traditional ferromagnetics, recent development on the deformation and fracture of soft ferromagnetic materials and the mechanics of ferromagnetic composites is critically reviewed.