Thickness dependent critical strain in Cu films adherent to polymer substrate
For the polymer-supported metal thin films that are finding increasing applications, the critical strain to nucleate microcracks ( εc ) should be more meaningful than the generally measured rupture strain. In this paper, we develop both electrical resistance method and microcrack analyzing method to determine εc of polymer-supported Cu films simply but precisely. Significant thickness dependence has been clearly revealed for εc of the polymer-supported Cu films, i.e., thinner is the film lower is εc . This dependence is suggested to cause by the constraint effect of refining grain size on the dislocation movability.