Hello!
I'm currently working on simulating thermo-mechanical stresses
in a
photovoltaic cell due to the soldering process, for my thesis.
I have done a simple model of a solar cell (silicon) with
EPOXY paste. To simulate the cooling down after the soldering process, I
want to
apply a uniform temperature of 343K
on
the top and the lower surface of the plate, then cool it down to room temperature and
analyze the stresses caused due to this. I believe for this we need
to
use the coupled-temperature displacement step where stresses due to
temperature changes can be analyzed and eexport the temperature result on each node and the stress in order to apply this result in another model and then to start another study with a crack by using XFEM method. I'm stuck here and I have a few
doubts, as mentioned below. It would be really helpful if someone
could
help me out with it.
1 the way to apply the stress result as a stress predefiend field on the second model. somebody can help me to use the SIGIN subroutine and if someone have another method to do this i ready .
Thank u so much. It would really help me towards completing
my thesis.
Baso75