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SES 2022: Recent Advances in Modeling and Simulation of Nano- and Micromechanics of Materials
Dear Colleagues,
We cordially invite you to present your work at our symposium titled "Recent Advances in Modeling and Simulation of Nano- and Micromechanics of Materials", as part of the 2022 Society of Engineering Science Annual Meeting (SES 2022). The meeting will be held on October 16-19, 2022 at Texas A&M University, College Station, Texas. The symposium is listed as Symposium 9.13 under the Solids and Structures thematic area on the submission website. To submit an abstract, please visit: https://na.eventscloud.com/eSites/658176/Homepage
The deadline for abstract submission is May 16, 2022. Further details on the conference and abstract submission can be found at the conference website: https://na.eventscloud.com/website/33592/
Please feel free to contact us with any questions or concerns. A description of the scope of our symposium is as follows:
Recent Advances in Modeling and Simulation of Nano- and Micromechanics of Materials
Nano and micromechanics of materials have attracted researchers’ attention due to their critical role in determining macroscopic behavior in these materials. This symposium seeks to bring together researchers working on novel areas of modeling and simulation of materials at the nano and micro-scale. The contributions welcomed in this symposium focus on modeling and simulation of nano- and micro-mechanics of materials, including but not limited to atomistic simulations (such as those made with atomistic potentials, molecular dynamics), electronic structure calculations (such as density functional theory), micro-mechanics models (such as dislocation dynamics), statistical mechanics, and the combination of these models with novel approaches such as multiscale and multiphysics modeling, data-driven and machine learning approaches. Research results on the fundamental understanding of deformation mechanisms in materials, actuation of materials, novel computational approaches, numerical implementations aspects, and application of established computational frameworks are welcome. Applications of such methods to a wide range of materials are also welcome, including crystalline (metals and alloys) and amorphous (glassy) and soft materials (such as polymers and liquid crystal elastomers).
We look forward to seeing you at SES 2022!
Sincerely,
Mauricio Ponga, University of British Columbia
Swarnava Ghosh, Oak Ridge National Laboratory
Dennis Kochmann, ETH Zürich
Jaime Marian, UCLA
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