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Finite element simulations of microvoid growth due to selective oxidation in binary alloys.

Dhirendra Kubair's picture

Selective oxidation induced void growth is observed in thermal barrier coating (TBC) systems used in gas turbines. These voids occur at the interface between the bond coat and the thermally grown oxide layer. In this article we develop the modeling framework to simulate microvoid growth due to coupled diffusion and creeping in binary alloys. We have implemented the modeling framework into an existing finite element program. The developed modeling framework and program is used to simulate microvoid growth driven by selective oxidation in a binary beta-NiAl alloy. Axisymmetric void growth due to the combined action of interdiffusion and creeping is simulated. The sharpness of the void and direction of creeping are considered as parameters in our study. Our simulations show that the voids dilate without any change in shape when creeping is equally likely in all the directions (isotropic). Void growth patterns similar to those observed in experiments are predicted when the creeping is restricted to occur only along the radial and tangential directions. A hemispherical void grows faster compared to a sharp void. The sharpness increases in the case of a sharp void and could lead to interactions with the neighboring voids leading to spallation of the thermally grown oxide layer as observed in experiments.

A modified version of this has appeared in "Modelling and Simulations in Materials Science and Engineering, 14, 1211-1223" doi:10.1088/0965-0393/14/7/009

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