Finite-Element Analysis of Current-Induced Thermal Stress n a Conducting Sphere
Understanding the electrothermal-mechanical behavior of electronic inter-
connects is of practical importance in improving the structural reliability of
electronic devices. In this work, we use the finite-element method to analyze
the Joule-heating-induced thermomechanical deformation of a metallic sphere
that is sandwiched between two rigid plates. The deformation behavior of the
sphere is elastic–perfectly plastic with Young’s modulus and yield stress
decreasing with temperature. The mechanical stresses created by Joule