Topic: Soft Electronic and Microfluidic Systems for the Skin Time: 8:00 AM, 12 August, 2022 (New York) 8:00 PM, 12 August, 2022 (Beijing) 10:00 PM, 12 August, 2022 (Sydney) 1:00 PM, 12 August, 2022 (London) Speaker: Prof. John A. Rogers
Professor Yonggang Huang of Northwestern University will receive the 2019 Theodore von Karman Medal from ASCE. The Theodore von Karman Medal recognizes distinguished achievement in engineering mechanics, applicable to any branch of civil engineering.
More information about the medal and the past winners can be found via the following link:
Good International news on Caltech and engineering. Ares Rosakis, chair of the Division of Engineering and Applied Science,describes Caltech as “a unique species among universities…a very interesting phenomenon”.More can be found in the attachment or at the link below
Professor David Barnett of Stanford University will receive the A.C. Eringen Medal from the Society of Engineering Science (SES). The prize is awarded in recognition of sustained outstanding achievements in Engineering Science. Professor Barnett will receive his award during the 49th Annual Technical Meeting of the Society of Engineering Science to be held at Georgia Institute of Technology from October 9-12, 2012.
The Rodney Hill Prize for 2012 is awarded to Professor Huajian Gao of Brown University, USA.
This prize, which consists of a plaque and a check for $25,000 (twenty-five thousand US Dollars), is to be awarded in recognition of outstanding research in the field of solid mechanics. The prize is to be awarded every 4 years, to coincide with the quadrennial International Congress of Theoretical and Applied Mechanics (ICTAM). The first prize was awarded at ICTAM 2008 in Adelaide.
ScienceWatch.com (affiliated with Thomson-Reuters), has ranked University of Illinois as the most cited institution in engineering from 1999 to 2009 (http://sciencewatch.com/inter/ins/10/10febTOP20ENG/). It is followed by Berkeley, MIT, Stanford, University of Michigan, and Georgia Tech.
To submit your abstracts to this symposium, select "Track 12 Mechanics of Solids, Structures and Fluids"; then select "Topic 12-26Mechanics of Thin Film and Multi-layer Materials".
Dae-Hyeong Kim et al from Prof. Rogers’ group (University of Illinois), Prof. Jizhou Song (University of Miami), Prof. Yonggang Huang (Northwestern University), and their collaborators at IHPC in Singapore and Tsinghua University just published a paper as the featured cover article in PNAS.
Science320, 507 (2008)
Stretchable and Foldable Silicon Integrated Circuits
Dae-Hyeong Kim, Jong-Hyun Ahn, Won Mook Choi, Hoon-Sik Kim, Jizhou Song, Yonggang Huang, Zhuangjian Liu, Chun Lu, and John A. Rogers
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