Blog posts
EM 388F Term Paper: Application of Fracture Mechanics on Cortical Bone Studies
One of the most common problems in older people is the fragility of the bones. Human bones are prone to fracture, and fracture of certain bones in the body such as the cortical bone may be fatal. Understanding of the fracture mechanism of bones is essential for the medical profession, and plays a major role in the study of osteoporosis as well.
EM 388F Term Paper: Subcritical Cracking of Low-k Dielectrics
Abstract
With the scaling of VLSI, ultra low-k dielectrics with porosity are being introduced to reduce the capacitance coupling. But due to the weak bonding strengths, low-k dielectrics may fail by environmental-assisted subcritical cracking, fracture at stresses far below the loads required for catastrophic failure, causing reliability issues. In this term paper, several references are reviewed to investigate the mechanism of subcritical cracking at multiscale levels.
About ABAQUS UMAT
Hi
I am working on probailistic modeling of damages in composite materials. I have my own developed mathematical model for calculating damage probability. Now I am trying to use this model in ABAQUS to see the effect of damages with a certain probability. Please kindly let me know if there is any reference code or tutorial for UMAT where I can apply the damages with different probabilities.
Thanks in Advance
Rezwanur Rahman
The University of Alabama
USA
EM388F Term Paper: Fracture of Orthotropic Materials under Mixed Mode Loading
The objective of this paper is to analyze the fracture of orthotropic materials, with emphasis on wood.
The effect of porosity on the stiffness and fracture energy of brittle organosilicates
Integrating porous low-permittivity dielectrics into Cu metallization is one of the strategies to reduce power consumption, signal propagation delays, and crosstalk between interconnects for the next generation of integrated circuits. However, the porosity and pore structure of these low-k dielectric materials also strongly affects other important material properties besides their dielectric constant.